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TSI310A-133CE

产品描述SBGA-304, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小98KB,共2页
制造商IDT (Integrated Device Technology)
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TSI310A-133CE概述

SBGA-304, Tray

TSI310A-133CE规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码SBGA
包装说明BGA-304
针数304
制造商包装代码BS304
Reach Compliance Codenot_compliant
ECCN代码3A001.A.3
其他特性ALSO REQUIRES 3.3V SUPPLY
地址总线宽度64
最大时钟频率133 MHz
外部数据总线宽度64
JESD-30 代码S-PBGA-B304
JESD-609代码e0
长度31 mm
湿度敏感等级3
端子数量304
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
认证状态Not Qualified
座面最大高度1.78 mm
最大供电电压2.7 V
最小供电电压2.3 V
标称供电电压2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度31 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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®
Tsi310
133-MHz PCI-X Bridge
Product Brief
allow full frequency range as required by the bus architecture. The two
bus clocks may be run synchronously or asynchronously, and a spread-
spectrum clock input is supported for either or both interfaces.
Memory Buffer Architecture
The Tsi310 memory buffer architecture has the following features (see
Data/Control unit in the Block Diagram):
Two 4-Kbyte burst read buffers that support up to eight
concurrent, upstream and downstream transactions
Two 1-Kbyte posted write buffers that support up to eight
concurrent, upstream and downstream transactions
Two 4-Byte single data phase buffers that support transaction
forwarding in either direction
Transaction Forwarding
The Tsi310 includes one data/control unit for downstream transactions
and one for upstream transactions. Each of these identical units
contains separate buffers for burst read, posted write, and single data
phase operations. Also included in these blocks are write queues, queue
compare logic, address decoding upstream for forwarding, control logic,
and other control functions. The clocking and reset control unit manages
these common device functions.
The device has I/O and Memory Base Address registers and Prefetch-
able Memory Base Address registers for downstream forwarding, as
well as inverse decoding for upstream forwarding, VGA-compatible
addressing, and palette snooping for upstream transactions. The Tsi310
uses a flat addressing model and supports 64-bit addressing and dual
address cycles.
The Tsi310 responds as a medium-speed device on both PCI-X Inter-
faces, and supports fast, back-to-back transactions as a bus slave.
PCI Bus Arbitration
Secondary
Bus Arbiter
80B6000_BK001_03
Device Overview
The IDT Tsi310 is a 64-bit PCI-X bus bridge that operates at speeds up
to 133 MHz, and supports transfer rates up to 1 GBps. The PCI-X
protocol is backward compatible with the PCI 2.2 bus standard ensuring
that legacy PCI-based systems are portable to the faster PCI-X environ-
ment.
The Tsi310 connects two electrically separate PCI-X bus domains,
allowing concurrent operations on both buses. This results in optimal
use of the buses in various system configurations, and enables hierar-
chical expansion of I/O bus structures. The device also supports config-
urations of PCI or PCI-X mode on either bus, and in any combination.
In addition, the Tsi310 provides extensive buffering and prefetching
mechanisms for efficient data transfer between two buses, facilitating
multi-threaded operation and high system throughput.
Block Diagram
Primary
Clock PLL
Secondary
Clock PLL
PCI-X
Interface
Data/Control Unit
Burst Read
Buffer
4 Kbytes
Read Queue
8 entries
Queue
Compare
Logic
Posted Write
Buffer
1 Kbyte
PW Queue
8 entries
Address
Decode
Single Data
Phase Buffer
4 Bytes
Control
Logic
PCI-X
Interface
Bus
Slave
Primary PCI/PCI-X Bus
Bus
Master
Secondary PCI/PCI-X Bus
Data/Control Unit
Burst Read
Buffer
4 Kbytes
Bus
Master
Read Queue
8 entries
Queue
Compare
Logic
Posted Write
Buffer
1 Kbyte
PW Queue
8 entries
Address
Decode
Single Data
Phase Buffer
4 Bytes
Control
Logic
Bus
Slave
JTAG
Clocking & Reset
PCI-X Interfaces
The Tsi310 has two identical PCI-X Interfaces that each handle PCI and
PCI-X transactions for its respective bus, and, depending on the type of
transaction, can act as either a bus master or a bus slave. These inter-
faces transfer data and control information flowing to and from the
blocks shown in the figure.
The Tsi310 uses the 3.3V signaling environment. It employs two phase-
locked loops (PLLs), one for the primary clock domain and one for the
secondary clock domain. The PLL for each domain is used when the
bus is operating in PCI-X mode. In PCI mode, the PLL is bypassed to
The Tsi310 uses an arbiter for the secondary bus, which can be disabled
if an external arbiter is employed. When enabled, bus arbitration is
provided for the Tsi310 and up to six external masters. Each bus master
can be assigned high or low priority, or be masked off.
Opaque Addressing (Optional)
The Tsi310 has an optional feature that can define an opaque (unde-
coded) memory address region to facilitate applications with embedded
processors.
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 2
2008 Integrated Device Technology, Inc.
September 4, 2009

TSI310A-133CE相似产品对比

TSI310A-133CE TSI310A-133CEY
描述 SBGA-304, Tray SBGA-304, Tray
Brand Name Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅
是否Rohs认证 不符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 SBGA SBGA
包装说明 BGA-304 BGA-304
针数 304 304
制造商包装代码 BS304 BSR304
Reach Compliance Code not_compliant compliant
ECCN代码 3A001.A.3 EAR99
其他特性 ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
地址总线宽度 64 64
最大时钟频率 133 MHz 133 MHz
外部数据总线宽度 64 64
JESD-30 代码 S-PBGA-B304 S-PBGA-B304
JESD-609代码 e0 e1
长度 31 mm 31 mm
湿度敏感等级 3 3
端子数量 304 304
最高工作温度 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 225 260
认证状态 Not Qualified Not Qualified
座面最大高度 1.78 mm 1.78 mm
最大供电电压 2.7 V 2.7 V
最小供电电压 2.3 V 2.3 V
标称供电电压 2.5 V 2.5 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL
端子节距 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 31 mm 31 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI

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