Preliminary
SF2137E-1
• Steep Roll-off Filter for 869.00 MHz Unlicensed Band
• Complies with Directive 2002/95/EC (RoHS)
• No Matching Required for Operation in 50
Ω
Environment
Absolute Maximum Ratings
Rating
Input Power Level
DC Voltage on any Non-ground Terminal
Operating Temperature Range
Storage Temperature Range in Tape and Reel
Maximum Soldering Profile, 5 Cycles/10 seconds Maximum
Pb
869.00 MHz
SAW Filter
Units
dBm
V
°C
°C
°C
14
5
Value
-30 to +65
-40 to +85
265
SM3030-6
Electrical Characteristics
Characteristic
Center Frequency
Insertion Loss, 868 to 870 MHz
Amplitude Ripple, 868 to 870 MHz
Attenuation Referenced to 0 dB:
DC to 828 MHz
828 to 849 MHz
881 to 890 MHz
890 to 925 MHz
925 to 1200 MHz
1200 to 1740 MHz
Source Impedance
Load Impedance
Case Style
Lid Symbolization, Y=year, WW=week, S=shift, Dot=pin 1 indicator
Standard Reel Quantity
Reel Size 7 Inch
Reel Size 13 Inch
Z
S
Z
L
45
30
22
22
40
36
51
40
35
38
49
49
50
50
SM3030-6 3.0 x 3.0 mm Nominal Footprint
994, YWWS
500 Pieces/Reel
3000 Pieces/Reel
Ω
Ω
dB
Sym
f
C
IL
Notes
Min
Typ
869.00
2.7
0.2
Max
3.5
0.7
Units
MHz
dB
dB
P-P
Electrical Connections
Connection
Port 1
Port 2
Case Ground
Terminals
2
5
All others
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
4.
5.
6.
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance
matching to 50
Ω
and measured with 50
Ω
network analyzer.
Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.
Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external
impedance matching design. See Application Note No. 42 for details.
The design, manufacturing process, and specifications of this filter are subject to change.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: info@rfm.com
©2009-2011 by RF Monolithics, Inc.
Page 1 of 5
SF2137E-1 2/8/11
SM3030-6 Case
6-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
N
K
L
Min
2.87
2.87
1.12
0.77
2.67
1.47
0.72
1.37
0.47
1.17
K
N
O
N
M
M
mm
Nom
3.00
3.00
1.25
0.90
2.80
1.60
0.85
1.50
0.60
1.30
3.20
1.70
1.05
0.81
0.38
Max
3.13
3.13
1.40
1.03
2.93
1.73
0.98
1.63
0.73
1.43
Min
0.113
0.113
0.044
0.030
0.105
0.058
0.028
0.054
0.019
0.046
Inches
Nom
0.118
0.118
0.049
0.035
0.110
0.063
0.033
0.059
0.024
0.051
0.126
0.067
0.041
0.032
0.015
Max
0.123
0.123
0.055
0.040
0.115
0.068
0.038
0.064
0.029
0.056
Case Materials
Materials
Solder Pad
Plating
Lid Plating
Body
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al
2
O
3
Ceramic
Pb Free
PCB Footprint Top View
Top View
B
1
6
C
6
Bottom View
G
H
1
994
YWWS
A 2
5
E
F
5
2
I
3
4
D
4
J
3
www.RFM.com E-mail: info@rfm.com
©2009-2011 by RF Monolithics, Inc.
Page 3 of 5
SF2137E-1 2/8/11
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