The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 26 April 2011.
INCH-POUND
MIL-PRF-19500/657B
26 January 2011
SUPERSEDING
MIL-PRF-19500/657A
22 February 2000
* PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED, TRANSISTOR DIE,
N AND P-CHANNEL, SILICON
VARIOUS TYPES JANHC AND JANKC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
*
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for N and P-channel, enhancement-mode,
MOSFET, radiation hardened, power transistor die. Two levels of product assurance are provided for each device
type as specified in MIL-PRF-19500.
* 1.2 Physical dimensions. See figures 1 through 8 herein.
1.3 Maximum ratings. See the applicable performance specification sheet from table I herein.
2. APPLICABLE DOCUMENTS
* 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
* 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
* DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
-
Semiconductor Devices, General Specification for.
* DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
* (Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch/
or
https://assist.daps.dla.mil/
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dscc.dla.mil.
Since
contact information can change, you may want to verify the currency of this address information using the
ASSIST Online database at
https://assist.daps.dla.mil/.
AMSC N/A
FSC 5961
MIL-PRF-19500/657B
* 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The requirements for acquiring the product described herein shall consist of this document and
MIL-PRF-19500.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable Qualified Manufacturer's List (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500.
* 3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
MIL-PRF-19500, and figures 1 through 8 herein.
3.4.1 Lead finish, material, and thickness. The metallization shall be aluminum for the top and chrome-nickel-
silver for the bottom. The nominal thickness of top metallization shall be 3 µm (4 µm nominal for all 60V die). The
nominal thickness of back metallization shall be 0.55 µm.
3.5 Electrostatic discharge protection. The devices covered by this specification require electrostatic protection.
* 3.5.1 Handling. MOS devices must be handled with certain precautions to avoid damage due to the accumulation
of static charge. However, the following handling practices are recommended (see 3.5).
a.
b.
c.
d.
e.
f.
g.
Devices should be handled on benches with conductive handling devices.
Ground test equipment, tools, and personnel handling devices.
Do not handle devices by the leads.
Store devices in conductive foam or carriers.
Avoid use of plastic, rubber, or silk in MOS areas.
Maintain relative humidity above 50 percent if practical.
Care should be exercised during test and troubleshooting to apply not more than maximum rated voltage to
any lead.
Gate must be terminated to source, R
≤
100 kΩ, whenever bias voltage is to be applied drain to source.
h.
2
MIL-PRF-19500/657B
2N7261, 2N7262, 2N7380, 2N7381, 2N7382, 2N7383, 2N7389, 2N7390
Dimensions
Ltr
*
BL
BW
OAH
LL1
LL2
LL3
LL4
Inches
Min
.173
.108
.0145
.042
.029
.0195
.026
Max
.189
.124
.0175
.044
.031
.0205
.028
Millimeters
Min
Max
4.39
4.80
2.74
3.15
0.368
0.445
1.07
1.12
0.74
0.79
0.495
0.521
0.66
0.71
*
*
*
*
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
* FIGURE 1. JANHCA and JANKCA (A-version) die dimensions for 2N7261, 2N7262, 2N7380, 2N7381, 2N7382,
2N7383, 2N7389, and 2N7390.
3
MIL-PRF-19500/657B
2N7261, 2N7262, 2N7380, 2N7381
Dimensions - 2N7261, 2N7380
Ltr
Min
A
B
C
D
E
F
.181
.116
.032
.017
.024
.035
Inches
Max
.185
.120
.034
.019
.026
.037
Millimeters
Min
4.60
2.95
.81
.43
.61
.89
Max
4.70
3.05
.86
.48
.66
.94
Min
.179
.114
.028
.018
.024
.033
Dimensions - 2N7262, 2N7381
Inches
Max
.183
.118
.030
.020
.026
.036
Millimeters
Min
4.55
2.90
.71
.46
.61
.84
Max
4.65
3.00
.76
.51
.66
.91
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Unless otherwise specified, tolerance is
±.005
inch (0.13 mm).
4. The physical characteristics of the die are: The back metals are chromium, nickel, and silver and
the back contact is the drain. The top metal is aluminum.
5. Die thickness is .015 inch (0.38 mm)
±.001
inch (0.025 mm).
* FIGURE 2. JANHCB and JANKCB (B-version) die dimensions for 2N7261, 2N7262, 2N7380 and 2N7381.
4
MIL-PRF-19500/657B
2N7382, 2N7389
Dimensions - 2N7382, 2N7389
Ltr
Min
A
B
C
D
E
F
.181
.116
.032
.017
.024
.035
Inches
Max
.185
.120
.034
.019
.026
.037
Millimeters
Min
4.60
2.95
.81
.43
.61
.89
Max
4.70
3.05
.86
.48
.66
.94
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Unless otherwise specified, tolerance is
±.005
inch (0.13 mm).
4. The physical characteristics of the die are: The back metals are chromium, nickel, and silver and
the back contact is the drain. The top metal is aluminum.
5. Die thickness is .015 inch (0.38 mm)
±.001
inch (0.025 mm).
* FIGURE 3. JANHCB and JANKCB (B-version) die dimensions for 2N7382, 2N7389
5
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
