ST72T71N5B1
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| Reach Compliance Code | not_compliant |
| 位大小 | 8 |
| CPU系列 | ST72 |
| JESD-30 代码 | R-PDIP-T56 |
| JESD-609代码 | e0 |
| 端子数量 | 56 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SDIP |
| 封装等效代码 | SDIP56,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 256 |
| ROM(单词) | 15024 |
| ROM可编程性 | UVPROM |
| 速度 | 4 MHz |
| 最大压摆率 | 2.5 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.78 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| ST72T71N5B1 | ST72E71J1D1 | ST72E71N5D1 | ST72T71J1B1 | |
|---|---|---|---|---|
| 描述 | ST72T71N5B1 | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,42PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,56PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,42PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| 位大小 | 8 | 8 | 8 | 8 |
| CPU系列 | ST72 | ST72 | ST72 | ST72 |
| JESD-30 代码 | R-PDIP-T56 | R-XDIP-T42 | R-XDIP-T56 | R-PDIP-T42 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 端子数量 | 56 | 42 | 56 | 42 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | SDIP | SDIP | SDIP | SDIP |
| 封装等效代码 | SDIP56,.6 | SDIP42,.6 | SDIP56,.6 | SDIP42,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 256 | 192 | 256 | 192 |
| ROM(单词) | 15024 | 8192 | 16384 | 8192 |
| ROM可编程性 | UVPROM | UVPROM | UVPROM | UVPROM |
| 速度 | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
| 最大压摆率 | 2.5 mA | 2.5 mA | 2.5 mA | 2.5 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.78 mm | 1.78 mm | 1.78 mm | 1.78 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 片上程序ROM宽度 | - | 8 | 8 | 8 |
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