电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

GS8161ZV18BGD-200

产品描述ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
产品类别存储    存储   
文件大小873KB,共34页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
标准  
下载文档 详细参数 全文预览

GS8161ZV18BGD-200概述

ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

GS8161ZV18BGD-200规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称GSI Technology
零件包装代码BGA
包装说明LBGA,
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间6.5 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B165
JESD-609代码e1
长度15 mm
内存密度18874368 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量165
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1MX18
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.4 mm
最大供电电压 (Vsup)2 V
最小供电电压 (Vsup)1.6 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度13 mm
Base Number Matches1

文档预览

下载PDF文档
Preliminary
GS8161ZV18B(T/D)/GS8161ZV32B(D)/GS8161ZV36B(T/D)
100-Pin TQFP & 165-Bump BGA
Commercial Temp
Industrial Temp
Features
• User-configurable Pipeline and Flow Through mode
• NBT (No Bus Turn Around) functionality allows zero wait
read-write-read bus utilization
• Fully pin-compatible with both pipelined and flow through
NtRAM™, NoBL™ and ZBT™ SRAMs
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 1.8 V +10%/–10% core power supply
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2M, 4M, and 8M devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ pin for automatic power-down
• JEDEC-standard 100-lead TQFP and 165-bump FP-BGA
packages
• Pb-Free 100-lead TQFP package available
18Mb Pipelined and Flow Through
Synchronous NBT SRAM
250 MHz–150 MHz
1.8 V V
DD
1.8 V I/O
rail for proper operation. Asynchronous inputs include the
Sleep mode enable, ZZ and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8161ZV18B(T/D)/GS8161ZV32B(D)/
GS8161ZV36B(T/D) may be configured by the user to operate
in Pipeline or Flow Through mode. Operating as a pipelined
synchronous device, in addition to the rising-edge-triggered
registers that capture input signals, the device incorporates a
rising-edge-triggered output register. For read cycles, pipelined
SRAM output data is temporarily stored by the edge triggered
output register during the access cycle and then released to the
output drivers at the next rising edge of clock.
The GS8161ZV18B(T/D)/GS8161ZV32B(D)/
GS8161ZV36B(T/D) is implemented with GSI's high
performance CMOS technology and is available in JEDEC-
standard 100-pin TQFP and 165-bump FP-BGA packages.
Functional Description
The GS8161ZV18B(T/D)/GS8161ZV32B(D)/
GS8161ZV36B(T/D) is an 18Mbit Synchronous Static SRAM.
GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other
pipelined read/double late write or flow through read/single
late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
Because it is a synchronous device, address, data inputs, and
read/ write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
Parameter Synopsis
-250
Pipeline
3-1-1-1
t
KQ
(x18/x36)
tCycle
Curr
(x18)
Curr
(x32/x36)
t
KQ
tCycle
Curr
(x18)
Curr
(x32/x36)
2.5
4.0
280
330
5.5
5.5
210
240
-200
3.0
5.0
230
270
6.5
6.5
185
205
-150
3.8
6.7
185
210
7.5
7.5
170
190
Unit
ns
ns
mA
mA
ns
ns
mA
mA
Flow Through
2-1-1-1
Rev: 1.00 9/2004
1/34
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
F2812断货原因
请问F2812为什么出现断货,什么时候恢复正常...
dyw07 微控制器 MCU
讨论 WINCE5 2440 中堆和栈的分配问题
在一个线程中定义一个数组, 大小为320*240*8 定义1:U8 cData; 这个应该存在系统的stack里面,结果data abort失败了,提示就是stack的问题,于是重新 定义2:U8 *cData = new U8 ,这个没 ......
heyuqi 嵌入式系统
置换 K60 塔式开发板
如题,手头上多了一套板子,139美金的那种,未拆封过,或许可以换TI的LM4F板子,可以加钱换。不过得提下,TI的M4板子似乎有点贵的,呃,相对塔式板似乎不值那么多。换等值的东西也行,暂时没想 ......
sharp4016 淘e淘
stc12c5a60s2
很好用喔...
邱宇sky 51单片机
C中嵌入asm(\"SETC INTM\")编译通不过?
C中嵌入asm(\"SETC INTM\"编译通不过,嵌入其它语句也一样,但是asm(\"NOP\"没问题,请问这是怎么回事? ...
lostmaple 模拟与混合信号
出OLIMEX LPC2478-STK开发板一块(ARM7,购于英国)
本帖最后由 gaochangw 于 2014-6-27 06:07 编辑 本人在英国留学,为了大二项目在英国亚马逊买了块儿OLIMEX的ARM7开发板,芯片是NXP LPC2478,带有一块儿320*240的TFT触摸屏只用了一个学期差 ......
gaochangw 淘e淘

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2270  1093  2046  5  1744  22  14  2  24  1 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved