RF C
ERAMIC
C
HIP
I
NDUCTORS
High frequency multi-layer chip inductors feature a monolithic body
made of low loss ceramic and high conductivity metal electrodes to
achieve optimal high frequency performance.
These RF chip inductors are compact in size and feature tin plated
nickel barrier terminations and tape and reel packaging which makes
them ideal for small size/high volume wireless applications.
A
PPLICATIONS
• CELL/PCS Modules
• Broadband Components
• RF Tranceivers
• Wireless LAN
• RFID
• Custom Applications
P
RODUCT
R
ANGE
S
UMMARY
EIA SIZE (mm)
0201 (0603)
0402 (1005)
0603 (1608)
0805 (2012)
SIZE CODE
L-05
L-07
L-14
L-15
L RANGE
1.0 - 33 nH
1.0 - 120 nH
1.0 - 220 nH
1.5 - 680 nH
Q FACTOR (Min.)
4 (100 MHz)
8 (100 MHz)
12 (100 MHz)
8 (100 MHz)
SRF (Typ.)
>21 GHz (1.0 nH)
>21 GHz (1.0 nH)
>23 GHz (1.0 nH)
>21 GHz (1.5 nH)
TEMPERATURE
-40°C to + 100°C
-40°C to + 100°C
-40°C to + 100°C
-40°C to + 100°C
M
ECHANICAL
C
HARACTERISTICS
E/B
T
0201 (0603)
Inches
mm
0402 (1005)
Inches
mm
0603 (1608)
Inches
mm
0805 (2012)
Inches
mm
W
L
Length
.024 ±.001”
Width
.012 ±.001”
Thickness
.012 ±.001”
End Band
.006 ±.002”
(0.6 ±0.03)
(0.3 ±0.03)
(0.3 ±0.03)
.039 ±.004” (1.00 ±.10)
.020 ±.004” (0.50 ±.10)
.020 ±.004” (0.50 ±.10)
.063 ±.006” (1.60 ±.15)
.031 ±.006” (0.80 ±.15)
.031 ±.006” (0.80 ±.15)
.012 ±.008” (0.30 ±.20)
.079 ±.008” (2.00 ±.20)
.047 ±.008” (1.20 ±.20)
.033 ±.008” (0.85 ±.20)
.020 ±.012” (0.50 ±.30)
(0.15 ±0.05) .009 ±.004” (0.23 ±.10)
H
OW TO
O
RDER
L-
DEVICE
Inductor
07
SIZE
05 = 0201
07 = 0402
14 = 0603
15 = 0805
C
TYPE
Ceramic
10N
VALUE
See Table
S = ± 0.3 nH
J= ± 5%
K = ± 10%
J
TOLERANCE
1.0 to 5.6 nH
6.8 nH and above
3.3 nH and above
V
TERMINATION
V =
Ni/Sn
4
MARKING
4 = No Marking
6 = Polarity Mark
T
TAPE & REEL
Size Code
Tape
Reel
0201 Y
Paper
5”
0201 T
Paper
7”
0402 T
Paper
7”
0603 E
Embossed 7”
0805 E
Embossed 7”
Qty
10,000
15,000
10,000
4,000
4,000
Part number written: L-07C10NJT4V
16
www.johansontechnology.com
RF C
HARACTERISTICS
C
HARACTERISTICS
(T
YPICAL
)
INDUCTANCE VS FREQUENCY: SIZE 0402
500
Q VS FREQUENCY: SIZE 0402
100
1N5
80
Inductance (nH)
100
47N
27N
15N
10
60
3N3
6N8
15N
Q
40
6N8
3N3
1N5
1.0
0.01
0.1
1.0
10
20
47N
0
0.01
0.1
1.0
27N
10
Frequency (GHz)
Frequency (GHz)
INDUCTANCE VS FREQUENCY: SIZE 0603
1000
Q VS FREQUENCY: SIZE 0603
100
2N2
80
Inductance (nH)
100
R10
56N
60
4N7
12N
Q
40
27N
56N
20
R10
0
0.01
27N
12N
10
4N7
2N2
1.0
0.01
0.1
1.0
10
0.1
1.0
10
Frequency (GHz)
Frequency (GHz)
INDUCTANCE VS FREQUENCY: SIZE 0805
1000
Q VS FREQUENCY: SIZE 0805
150
2N2
Inductance (nH)
100
R15
R10
56N
100
4N7
12N
27N
56N
R10
R15
0.1
1.0
10
12N
10
4N7
2N2
1.0
Q
50
0
0.01
27N
0.01
0.1
1.0
10
Frequency (GHz)
Frequency (GHz)
M
ECHANICAL
& E
NVIRONMENTAL
C
HARACTERISTICS
SPECIFICATION
SOLDERABILITY:
RESISTANCE TO SOLDERING:
THERMAL SHOCK:
LIFE TEST:
HUMIDITY RESISTANCE:
TERMINAL ADHESION:
PCB DEFLECTION:
Solder coverage
≥
75% of electrodes L=±10% Q=± 20%
No apparent damage Solder coverage
≥
75% L=±10% Q=± 20%
No apparent damage L=±10% Q=± 20%
No apparent damage L=±10% Q=± 20%
Cap. change: 2% or .5pF Max
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
TEST PARAMETERS
Preheat 120±20°C for 1 min. Dip 230±10°C for 3±1 sec.
Preheat 120±20°C for 1 min. Dip 260±10°C for 10±1 sec.
100 cycles: 30±3 minutes @ +100°C then 30±3 min. @ -40°C
1000 ±48 Hours @ +85±2°C, rated current (1-2 hour recovery)
1000 ±48 Hours @ +40±2°C, 90-95% relative humidity,
rated current (1-2 hour recovery)
Lateral pull force: 0201
≥1.0Lbs
0402
≥1.6Lbs
For 0603
≥2.2Lbs
For 0805
≥4.4Lbs
Glass Epoxy PCB: 1 mm deflection
www.johansontechnology.com
19
FPGA/CPLD
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