PulseGuard
®
Suppressors
Reference Dimensions:
Sn
1.60 (.063")
0.076 (.003") MIN
Surface Mount Polymeric ESD Suppressors
PGB1 Series Lead-Free
1.04
(.041") REF
0.787 (.031")
Description
0.254 (.010") MIN
Reference Dimensions:
0.356 (.014")
Reflow
Solder
0.508
Reflow
(.020")
Solder
1.01 (.040")
2.24 (.088")
Wave
Solder
0.762 (.030")
Sn
2.997
(.118")
3.05 (1.20")
2.29
(.090")
1.01 (.040")*
1.27
(.050")
3.30 (1.30")
PulseGuard ESD Suppressors help protect sensitive
electronic equipment against electrostatic discharge (ESD).
They supplement the on-chip protection of integrated
circuitry and are best suited for low-voltage, high-speed
applications where low capacitance is important. Data
ports utilizing such high-speed protocols as USB 2.0,
IEEE1394, HDMI and DVI can benefit from this new
technology.
PulseGuard suppressors use polymer composite materials
to suppress fast-rising ESD transients (as specified in IEC
61000-4-2 and MIL-STD-883C), while adding virtually no
capacitance to the circuit.
Features
• RoHS compliant and
lead-free
• Ultra-low capacitance
• Low leakage current
• Fast response time
• Bi-directional
• Withstands multiple
ESD strikes
• Standard EIA SOCM-1608
Applications
package
• Compatible with
pick-and-place processes
• Available in 1000, 3000,
5000 and 10000 piece
reels (EIA-RS481)
1.27 (.050")
1.01 (.040")
1.27
(.050")
1.01 (.040")
1.27 (.050")
2.032
(.080")
0.635
2.032 (.080")*
Equivalent Circuit
(.025")
Note: For wave solder, increase the spacing
in both the horizontal and vertical
Reference Dimensions:
dimensions by
0.254 (.010") where denoted by an asterisk (*)
Reflow Solder
0.71 (.028")
0.74
SOT23 Device
(.029")
1.27
(.050")
0402 and 0603 Devices
1
0.51
(.020")
0.762 (.030")
0.762 (.030")
0.076
(.003") MIN (TYP)
0.762
(.030")
Equivalent Circuit
(.032") REF
2.03 (.080") TYP
2
0.81
Equivalent Circuit
(.050") TYP
3
1.27
0.51 (.020")
0.203
(.008") TYP
0.127
(.005") TYP
0.635 (.025")
0.74
(.029")
0.279
(.011")
Sn
NOTE: When wave soldering, the gap between pads should be
covered with photo-imageable solder mask to prevent bridging
between terminations under the component. Also the spacing
between the ground contacts should be increased from
.635mm (.025") to .889 (.035").
1
2
0805 Device
Equivalent Circuit
1
6
• HDTV Hardware
• Laptop/Desktop
0.406 (.016") TYP
Computers
• Network Hardware
• Computer Peripherals
• Digital Cameras
• External Storage
• Set-Top Boxes
2
5
3
4
Product Characteristics
Part Number
PGB1010402
PGB1010603
PGB102ST23
PGB1040805
Lines Protected
1
1
2
4
Component
Package
0402
0603
SOT23
0805
PGB1 Series
Specifications are subject to change without notice.
1
Electronics Designers Guide
www.littelfuse.com
©2007 Littelfuse
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
Electrical Characteristics
Specification
ESD Capability
IEC 61000-4-2 Direct Discharge
IEC 61000-4-2 Air Discharge
Peak Voltage (typical)
Clamping Voltage (typical)
Rated Voltage
Capacitance
Response Time
Leakage Current
ESD Pulse Withstand
PGB1010402
–
8kV
15kV
1000V
250V
12VDC max
0.055pF
<1nS
<1nA
100 pulses min
PGB1010603
–
8kV
15kV
500V
150V
24VDC max
0.055pF
<1nS
<1nA
PGB102ST23
–
8kV
15kV
500V
150V
24VDC max
0.055pF
<1nS
<1nA
PGB1040805
–
8kV
15kV
500V
150V
24VDC max
0.055pF
<1nS
<1nA
Measured at 1MHZ
Measured per IEC 61000-4-2
8kV Direct Discharge
1
Measured at 6VDC
Some shifting in
characteristics may occur
when tested over multiple
pulses at a very rapid rate
Measured per IEC 61000-4-2
8kV Direct Discharge
1
Measured per IEC 61000-4-2
8kV Direct Discharge
1
Notes
1000 pulses min 1000 pulses min 1000 pulses min
Notes:
1
Testing performed on Littelfuse Test Set up as described in typical test setup section.
Design Consideration
Because of the fast rise-time of the ESD transient, proper placement of PulseGuard suppressors are a key design
consideration to achieving optimal ESD suppression. The devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard suppressors (conected from signal/data line to ground) directly
behind the connector so that they are the first board-level circuit component encountered by the ESD transient.
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
217°C
60 – 150 seconds
250
+0/-5
°C
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
PGB1 Series
Specifications are subject to change without notice.
2
Electronics Designers Guide
www.littelfuse.com
©2007 Littelfuse
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
Physical Specifications
Materials
Solderability
Soldering
Parameters
Body: Glass Epoxy
Terminations: 100% Copper/Nickel/Tin
MIL-STD-202, Method 208 (95% coverage)
Wave solder - 260°C, 10 seconds
maximum Reflow solder - 260°C, 30
seconds maximum
Environmental Specifications
Operating Temperature
Moisture Resistance,
Steady State
Thermal Shock
-65°C to +125°C
MIL-STD-833, Method 1004.7,
85% RH, 85°C, 1000 hours
MIL-STD-202 Method 107G,
-65°C to 125°C, 30 min. cycle,
10 cycles
MIL-STD-202F, Method 201A,
(10 to 55 to 10 Hz, 1 min. cycle,
2grs each in X-Y-Z)
ASTM D-543, 4hrs @ 40°C,
3 solutions (H
2
O, detergent
solution and defluxer)
Per EIA-576 test
Operating
-65°C to +125°C
Temperature Range
Vibration
Chemical Resistance
Solder Leach Resistance and
Terminal Adhesion
Dimensions
0402 Device
.99
(.039")
.51
(.020")
.24
(.009")
.310
(.012")
.15
(.006")
1.01 (.040")*
Reference Dimensions:
SOT23 Device
Reflow
Solder
2.24 (.088")
1.01 (.040")
1.27
(.050")
Sn
2.997
(.118")
.254
(.010")
2.29
(.090")
1.01 (.040")
1.27
(.050")
1.01 (.040")
2.032
(.080")
.584
(.023")
.381
(.015")
0.635
(.025")
2.032 (.080")*
0.076
(.003") MIN (TYP)
0.762
(.030")
0.81
(.032") REF
0.51
(.020")
Note: For wave solder, increase the spacing
in both the horizontal and vertical dimensions by
0.254 (.010") where denoted by an asterisk (*)
.558
(.022")
REFLOW SOLDER
0603 Device
Dimensions:
Reference
Sn
1.60 (.063")
0.076 (.003") MIN
1.04
(.041") REF
0.787 (.031")
Reference Dimensions:
0805 Device
Equivalent Circuit
0.71 (.028")
1.27
(.050")
Reflow Solder
3
2.03 (.080") TYP
0.74
(.029")
1.27
(.050") TYP
0.254 (.010") MIN
0.356 (.014")
Reflow
Solder
0.508 (.020")
Wave
Solder
0.762 (.030")
0.635 (.025")
0.51 (.020")
0.279
(.011")
1
0.203
(.008") TYP
0.74
(.029")
3.30 (1.30")
2
0.127
(.005") TYP
Sn
3.05 (1.20")
1.27 (.050")
1.27 (.050")
0.762 (.030")
0.762 (.030")
NOTE: When wave soldering, the gap between pads should be
covered with photo-imageable solder mask to prevent bridging
between terminations under the component. Also the spacing
between the ground contacts should be increased from
.635mm (.025") to .889 (.035").
0.406 (.016") TYP
Equivalent Circuit
1
2
Reference Dimensions:
mm (inch)
Equivalent Circuit
1
6
2
5
PGB1 Series
Specifications are subject to change without notice.
3
Electronics Designers Guide
3
4
www.littelfuse.com
©2007 Littelfuse
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
Part Numbering System
PGB1 01 0603 MR
LEAD-FREE PULSEGUARD
®
ESD SUPPRESSORS
LINES PROTECTED:
01 = 1 line
02 = 2 lines
04 = 4 lines
QUANTITY & PACKAGING CODE:
MR = 1000 pieces
WR = 3000 pieces
NR = 5000 pieces
KR = 10,000 pieces
DEVICE SIZE CODE:
0603 = 0603 (1608)
ST23 = SOT23
0805 = 0805 (2012)
0402 = 0402 (1005)
Packaging
Part Number
PGB1010402
PGB1010603
PGB1040805
PGB102ST23
PGB1010603
Quantity &
Packaging Code
KR
MR
MR
WR
NR
Quantity
10000
1000
1000
3000
5000
Packaging Option
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Packaging Specification
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
Tape and Reel Specifications
T
t
D
d
+
+
D
s
+
+
P
d
T
w
+
+
+
+
P
h
C
t
P
s
P
w
Description
C
t
- Cover tape thickness
D
d
- Drive hole diameter
D
s
- Drive hole spacing
P
d
- Pocket depth
P
h
- Pocket height
P
s
- Pocket spacing
P
w
- Pocket width
T
t
- Carrier tape thickness
T
w
- Carrier tape width
0603 Series
Measurement (mm)
0.06
1.50
4.00
0.58
1.85
4.00
1.02
0.65
8.00
SOT23 Series
Measurement (mm)
0.06
1.50
4.00
1.02
3.23
4.00
2.46
0.30
8.00
0805 Series
Measurement (mm)
0.06
1.50
4.00
0.58
2.21
4.00
1.45
0.65
8.00
PGB1 Series
Specifications are subject to change without notice.
4
Electronics Designers Guide
www.littelfuse.com
©2007 Littelfuse
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
Typical Test Setup
FARADAY CAGE
COMPUTER
AGILENT INFINIIUM
1.5 GHz 8 GS/s
30dB PASTERNAK ATTENUATOR
PE7025-30
TEKTRONIX LOW CAP PROBE
6158 (20x TIP)
QUADTECH 1865
RESISTANCE METER
RESISTANCE
TEST FIXTURE
ESD TEST FIXTURE
TEST BOARD W/ DUT
ESD PULSE GENERATOR
PGB1 Series
Specifications are subject to change without notice.
5
Electronics Designers Guide
www.littelfuse.com
©2007 Littelfuse
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