D Flip-Flop, 2-Func, Positive Edge Triggered, CMOS, CDFP14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | RCA |
| 包装说明 | DFP, FL14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDFP-F14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 功能数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5/15 V |
| Prop。Delay @ Nom-Sup | 400 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| CD4013BK/3 | CD4013BF/3A | CD4013BF/3W | CD4013BEX | CD4013BEX98 | CD4013BD/3 | CD4013BD/3W | |
|---|---|---|---|---|---|---|---|
| 描述 | D Flip-Flop, 2-Func, Positive Edge Triggered, CMOS, CDFP14 | D Flip-Flop, 2-Func, Positive Edge Triggered, CMOS, CDIP14 | D Flip-Flop, 2-Func, Positive Edge Triggered, CMOS, CDIP14 | D Flip-Flop, 2-Func, Positive Edge Triggered, CMOS, PDIP14, | D Flip-Flop, 2-Func, Positive Edge Triggered, CMOS, PDIP14, | D Flip-Flop, 2-Func, Positive Edge Triggered, CMOS, CDIP14 | D Flip-Flop, 2-Func, Positive Edge Triggered, CMOS, CDIP14 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| JESD-30 代码 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| 封装代码 | DFP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 表面贴装 | YES | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Prop。Delay @ Nom-Sup | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | - | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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