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CY7C1241V18-333BZXC

产品描述QDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
产品类别存储    存储   
文件大小647KB,共28页
制造商Cypress(赛普拉斯)
标准
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CY7C1241V18-333BZXC概述

QDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

CY7C1241V18-333BZXC规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Cypress(赛普拉斯)
零件包装代码BGA
包装说明LBGA, BGA165,11X15,40
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间0.45 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)333 MHz
I/O 类型SEPARATE
JESD-30 代码R-PBGA-B165
JESD-609代码e1
长度17 mm
内存密度33554432 bit
内存集成电路类型QDR SRAM
内存宽度8
湿度敏感等级3
功能数量1
端子数量165
字数4194304 words
字数代码4000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织4MX8
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源1.5/1.8,1.8 V
认证状态Not Qualified
座面最大高度1.4 mm
最大待机电流0.3 A
最小待机电流1.7 V
最大压摆率1.12 mA
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间40
宽度15 mm
Base Number Matches1

文档预览

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CY7C1241V18, CY7C1256V18
CY7C1243V18, CY7C1245V18
36-Mbit QDR™-II+ SRAM 4-Word Burst
Architecture (2.0 Cycle Read Latency)
Features
Configurations
With Read Cycle Latency of 2.0 cycles:
CY7C1241V18 – 4M x 8
CY7C1256V18 – 4M x 9
CY7C1243V18 – 2M x 18
CY7C1245V18 – 1M x 36
Separate independent read and write data ports
Supports concurrent transactions
300 MHz to 375 MHz clock for high bandwidth
4-Word Burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 750 MHz) at 375 MHz
Read latency of 2.0 clock cycles
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate Port Selects for depth expansion
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency providing most current data
Core V
DD
= 1.8V ± 0.1V; IO V
DDQ
= 1.4V to V
DD[1]
HSTL inputs and variable drive HSTL output buffers
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Functional Description
The CY7C1241V18, CY7C1256V18, CY7C1243V18, and
CY7C1245V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with Quad Data Rate-II+ (QDR-II+) architecture.
QDR-II+ architecture consists of two separate ports to access
the memory array. The read port has dedicated data outputs to
support read operations and the write port has dedicated data
inputs to support write operations. QDR-II+ architecture has
separate data inputs and data outputs to completely eliminate
the need to “turn around” the data bus required with common IO
devices. Each port can be accessed through a common address
bus. Read and write addresses are latched on alternate rising
edges of the input (K) clock. Accesses to the QDR-II+ read and
write ports are completely independent of one another. To
maximize data throughput, both read and write ports are
equipped with Double Data Rate (DDR) interfaces. Each
address location is associated with four 8-bit words
(CY7C1241V18), 9-bit words (CY7C1256V18), 18-bit words
(CY7C1243V18), or 36-bit words (CY7C1245V18), that burst
sequentially into or out of the device. Because data can be trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K), memory bandwidth is maximized while simpli-
fying system design by eliminating bus “turn-arounds”.
Depth expansion is accomplished with Port Selects for each port.
Port selects enable each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
375 MHz
375
1240
333 MHz
333
1120
300 MHz
300
1040
Unit
MHz
mA
Note
1. The QDR consortium specification for V
DDQ
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting
V
DDQ
= 1.4V to V
DD
.
Cypress Semiconductor Corporation
Document Number: 001-06365 Rev. *D
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised March 12, 2008
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