F-208
HLE–116–02–G–DV
HLE–110–02–G–DV–A
HLE–130–02–G–DV
.025" SOCKET
HLE SERIES
SQ
SPECIFICATIONS
For complete specifications
and recommended PCB layouts
see www.samtec.com?HLE
Insulator Material:
Black Liquid
Crystal Polymer
Contact Material:
BeCu
Plating:
Au over 50µ"
(1,27µm) Ni
Current Rating:
2.5A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(1,78mm) .070" to
(3,43mm) .135", pass-through,
or (2,59mm) .102" min for
bottom entry
Insertion Force:
(Single contact only)
2oz (0,56N) avg.
Withdrawal Force:
(Single contact only)
1.6oz (0,44N) avg.
RoHS Compliant:
Yes
HLE
NO.
1
PER PINS
ROW
02
PLATING
OPTION
DV
TAIL
OPTION
OTHER
OPTION
Mates With:
TSW, MTSW, DW,
EW, ZW, TLW, TSM,
MTLW, HW
–BE
–G
= 10µ" (0,25µm) Gold
Leave blank for
Surface Mount
= Bottom Entry
(Requires Surface
Mount or –PE)
–S
= 30µ" (0,76µm) Gold
on contact,
Matte Tin on tail
(3,66)
.144
(6,60)
.260
–A
= Alignment Pin
(4 positions min.)
Metal or plastic at
Samtec discretion
(1,27)
.050
02 thru 50
(Requires –BE for Bottom Entry)
(1,60)
.063
DIA
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (02-20)
(0,15mm) .006" max (21-50)
–TE
= Through-Hole
Top Entry
–LC
= Locking Clip
(2 positions min.)
(1,27)
.050
No. of Positions x (2,54) .100
(2,54)
.100
(1,42)
.056
02
(3,05)
.120
(5,08)
.200
(2,54)
.100
01
–K
= (6,50mm) .256"
DIA Polyimide
Film Pick &
Place Pad
(3 positions min.)
Not available
with –TE or
–PE tail option
(2,54)
.100
–PE
(3,51)
.138
(0,51)
.020
= Through-hole
Pass Through Entry
–P
= Metal Pick &
Place Pad
(3 positions min.)
(7,11) .280
x
(5,71) .225
–PE
–TE
(2,30)
.090
(7,62)
.300
(Requires –BE for Bottom Entry)
(3,86)
.152
–TR
= Tape & Reel
Packaging
(29 positions max.)
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
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