RISC Microprocessor, 32-Bit, 167MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
参数名称 | 属性值 |
厂商名称 | Motorola ( NXP ) |
包装说明 | BGA, |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.3 |
其他特性 | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | 32 |
位大小 | 32 |
边界扫描 | YES |
最大时钟频率 | 66.67 MHz |
外部数据总线宽度 | 64 |
格式 | FIXED POINT |
集成缓存 | YES |
JESD-30 代码 | S-CBGA-B255 |
长度 | 21 mm |
低功率模式 | YES |
端子数量 | 255 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | BGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
认证状态 | Not Qualified |
座面最大高度 | 3 mm |
速度 | 167 MHz |
最大供电电压 | 2.625 V |
最小供电电压 | 2.375 V |
标称供电电压 | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子节距 | 1.27 mm |
端子位置 | BOTTOM |
宽度 | 21 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
Base Number Matches | 1 |
MPE603PRX166LX | MPE603PFE166LX | MPE603PRX200LX | |
---|---|---|---|
描述 | RISC Microprocessor, 32-Bit, 167MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | RISC Microprocessor, 32-Bit, 167MHz, CMOS, CQFP240, 32 X 32 MM, 0.50 MM PITCH, CERAMIC, QFP-240 | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 |
厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
包装说明 | BGA, | FQFP, | BGA, |
Reach Compliance Code | unknown | unknown | unknown |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | 32 | 32 | 32 |
位大小 | 32 | 32 | 32 |
边界扫描 | YES | YES | YES |
最大时钟频率 | 66.67 MHz | 66.67 MHz | 66.67 MHz |
外部数据总线宽度 | 64 | 64 | 64 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | YES | YES | YES |
JESD-30 代码 | S-CBGA-B255 | S-CQFP-G240 | S-CBGA-B255 |
长度 | 21 mm | 31.305 mm | 21 mm |
低功率模式 | YES | YES | YES |
端子数量 | 255 | 240 | 255 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | BGA | FQFP | BGA |
封装形状 | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | FLATPACK, FINE PITCH | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3 mm | 4.15 mm | 3 mm |
速度 | 167 MHz | 167 MHz | 200 MHz |
最大供电电压 | 2.625 V | 2.625 V | 2.625 V |
最小供电电压 | 2.375 V | 2.375 V | 2.375 V |
标称供电电压 | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES |
技术 | CMOS | CMOS | CMOS |
端子形式 | BALL | GULL WING | BALL |
端子节距 | 1.27 mm | 0.5 mm | 1.27 mm |
端子位置 | BOTTOM | QUAD | BOTTOM |
宽度 | 21 mm | 31.305 mm | 21 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
Base Number Matches | 1 | 1 | - |
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