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GS8170EW36C-300IT

产品描述Standard SRAM, 512KX36, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
产品类别存储    存储   
文件大小938KB,共39页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
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GS8170EW36C-300IT概述

Standard SRAM, 512KX36, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS8170EW36C-300IT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称GSI Technology
零件包装代码BGA
包装说明LBGA,
针数209
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间5.5 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B209
长度22 mm
内存密度18874368 bit
内存集成电路类型STANDARD SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量209
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX36
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度1.7 mm
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

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Preliminary
GS8170EW18/36/72C-333/300/250
209-Bump BGA
Commercial Temp
Industrial Temp
18Mb
Σ1x1
Early Write
SigmaRAM™ SRAM
250 MHz–333 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
Features
• Early Write mode
• User-configurable pipeline and flow through operation
• JEDEC-standard SigmaRAM
pinout and package
• 1.8 V +150/–100 mV core power supply
• 1.5 V or 1.8 V I/O supply
• Dual Cycle Deselect in Pipeline mode
• Synchronous Burst operation
• Fully coherent read and write pipelines
• Echo Clock outputs track data output drivers in Pipeline
mode
• ZQ mode pin for user-selectable output drive strength
• Byte write operation (9-bit bytes)
• 2 user-programmable chip enable inputs for easy depth
expansion.
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 32Mb, 64Mb, and 128Mb devices
- 333
3.0 ns
1.6 ns
5 ns
5 ns
Bottom View
209-Bump, 14 mm x 22 mm BGA
1 mm Bump Pitch, 11 x 19 Bump Array
Pipeline mode
Flow Through mode
tKHKH
tKHQV
tKHKH
tKHQV
Functional Description
Because
ΣRAMs
are synchronous devices, address, data
inputs, and read/write control inputs are captured on the rising
edge of the input clock. Write cycles are internally self-timed
and initiated by the rising edge of the clock input. This feature
eliminates complex off-chip write pulse generation required by
asynchronous SRAMs and simplifies input signal timing.
A
ΣRAM
may be configured by the user to read in Pipeline or
Flow Through mode. In Pipeline mode, single data rate
ΣRAMs
incorporate a rising-edge-triggered output register. For
read cycles, a pipelined SRAM’s output data is staged at the
input of an edge-triggered output register during the access
cycle and then released to the output drivers at the next rising
edge of clock.
GS8170EW18/36/72C
ΣRAMs
are implemented with GSI's
high performance CMOS technology and are packaged in a
209-bump BGA.
SigmaRAM Family Overview
GS8170EW18/36/72 SigmaRAMs (ΣRAM
™)
are built in
compliance with the
ΣRAM
pinout standard for synchronous
SRAMs. They are 18,874,368-bit (18Mb) SRAMs. These are
the first in a family of wide, very low voltage CMOS I/O
SRAMs designed to operate at the speeds needed to implement
economical high performance networking systems.
GSI's
ΣRAMs
are offered in a number of configurations that
emulate other synchronous SRAMs, such as Burst RAMs,
NBT, Late Write, or Double Data Rate (DDR) SRAMs. The
logical differences between the protocols employed by these
RAMs hinge mainly on various combinations of address
bursting, output data registering and write cueing. The
ΣRAM
family standard allows a user to implement the interface
protocol best suited to the task at hand.
Rev: 1.00d 6/2002
1/39
© 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
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