(TIA) optimized for GPON fiber optic applications.
The MAX24011 implements a complete analog front-end,
converting the photo-detector current to a differential ana-
log voltage signal.
The MAX24011 has a low-noise front-end, an AGC
and typical differential transimpedance of 23kΩ. The
MAX24011 also provides a filtered bias current to the
photo detector cathode for internally biased PIN applica-
tions and a received signal strength indicator (RSSI) out-
put. The RSSI is either derived from the current supplied
by the PDC regulator, or represents the average current
into the PDA pin for use with externally biased photode-
tectors, such as an APD.
The MAX24011 is available in die form for mounting on
a header to create a ROSA when combined with suitable
optics and photo-detector diode.
Benefits and Features
●
-33dBm (typ) Sensitivity With APD
●
Up to 2.5Gbps (NRZ) Data Rates
●
190nA
RMS
(typ) Input-Referred Noise
●
Automatic Gain Control of Overload
●
31mA (typ)
Current Consumption
●
Received Signal Strength Indicator Output from PDA
or PDC
●
-40°C to +95°C Operating Temperature Range
Functional Diagram
V
CC
V
CCO
Applications
●
GPON, ONU Receivers
●
OC-48 Transceiver Modules
VOLTAGE
REGULATOR
For related parts and recommended products to use with this part, refer
to
www.maximintegrated.com/MAX24011.related.
50I
SIGNAL DETECT
AND DC RESTORE
50I
Ordering Information
appears at end of data sheet.
PDC
R
F
PDA
GND
AMPLIFIER
AGC
AMP
O/P
BUFFER
RX+
RX-
SIGNAL
STRENGTH
INDICATOR
MAX24011
RSSI_DIR
RSSI_SEL
RSSI_OUT
19-6654; Rev 1; 9/13
MAX24011
2.5Gbps Transimpedance Amplifier
Absolute Maximum Ratings
Voltage Range on V
CC
.........................................-0.3V to +4.0V
Voltage Range on Any Pad Not Otherwise Specified
(with respect to GND
_
)....................... -0.3V to (GND x +0.3V)
Maximum PDA Input Current V
CC
...................... 4mA Operating
Maximum PDA Input Current ...............................................4mA
Operating Temperature Range ........................... -40°C to +95°C
Junction Temperature ....................................... -55°C to +150°C
Storage Temperature Range .............................-55ºC to +150°C
Die Attach Temperature (soldering, 10s) ......................... +400°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(V
CC
= 2.97V to +3.63V, T
A
= -40°C to +95°C.) (Note 1)
PARAMETER
Operating Supply Voltage
Operating Temperature
Supply Current
V
CC
= 3.3V, output open circuit
SYMBOL
V
CC
CONDITIONS
MIN
2.97
-40
31
TYP
3.3
MAX
3.63
+95
UNITS
V
°C
mA
RECEIVER CHARACTERISTICS
PARAMETER
Power-Supply Rejection Ratio
Input Bias Voltage
Minimum Photodiode Cathode Bias
Transimpedance
Output Resistance
-3dB Bandwidth
SYMBOL
CONDITIONS
(V
DP
- V
DN
)/ΔV
CC
, 50kHz to 4MHz;
no V
CC
decoupling
PDA voltage
PDC voltage
At 100MHz, input current < 9
μ
A
P-P
Differential
Input current 2
μ
A
P-P
, 100Ω
differential output load, APD
capacitance 0.35pF
Measured into 1.866GHz, 4th order
Bessel-Thomson (BT) filter, APD
capacitance 0.35pF
DJ < 220 mUI
P-P
specification
PRBS 15 < 2.5mA
P-P
Input current 18μA
P-P
to 3.6mA
P-P
,
overload
200
15
80
MIN
TYP
15
0.85
2.5
23
100
1.8
32.5
120
MAX
UNITS
dB
V
V
kΩ
Ω
GHz
Input-Referred Noise
Input Overload AC
Deterministic Jitter
Differential Output Swing
190
3.2
100
200
320
nA
RMS
mUI
P-P
mA
P-P
mV
P-P
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Maxim Integrated
│
2
MAX24011
2.5Gbps Transimpedance Amplifier
RECEIVER CHARACTERISTICS (continued)
PARAMETER
Low-Frequency -3db Cutoff
Gain Flatness
SYMBOL
CONDITIONS
DC-coupled
100MHz to 1250MHz; flatness
referred to 100MHz; input current
≤ 500μA
P-P
DC input current 5mA to 1.27mA
(after single-point calibration)
RSSI sourcing current (RSSI_DIR
open circuit)
RSSI sinking current (RSSI_DIR
connected to GND)
MIN
TYP
5
±2
MAX
30
UNITS
kHz
dB
RSSI Accuracy
RSSI Gain
Maximum RSSI Compliance
Voltage
Minimum RSSI Compliance Voltage
±20
1
V
CC
-
0.3
GND +
0.45
%
mA/mA
V
V
Note 1:
Electrical specifications are production tested at T
A
= +25°C. Specifications over the entire operating temperature range are
guaranteed by design and characterization. Typical specifications are at T
A
= +25°C, 3.3V.
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Maxim Integrated
│
3
MAX24011
2.5Gbps Transimpedance Amplifier
Pad Configuration
20
V
CC
N.C.
V
CCO
D
OUTP
GND
1
GND
GND
PDC
RSSI_SEL
PDA
MAX24011
RSSI_DIR
GND
GND
GND
GND
RSSI_OUT
N.C.
N.C.
N.C.
DOUTN
GND
Pad Description
PIN
1, 4, 5, 11,
12, 15, 16
2
3
6
7
8, 9, 19
10
NAME
GND
PDC
PDA
RSSI_OUT
N.C.
N.C.
D
OUT
N
DIR
Power
O/P
I/P
O/P
I/P
—
O/P
TYPE
Ground
Analog
Analog
Analog
Analog
—
Analog
Connect to ground
Supplies bias voltage to internally biased PIN photodiode cathode
Amplifier input which accepts input current from photodiode anode
Outputs a current proportional to mean photodiode input current. Sources
current when RSSI_DIR is unconnected.
No connection. Do not connect.
No connection. Do not connect.
Negative CML Output. Positive current into PDA causes voltage to fall on
D
OUT
N pad.
FUNCTION
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Maxim Integrated
│
4
MAX24011
2.5Gbps Transimpedance Amplifier
Pad Description (continued)
PIN
13
NAME
RSSI_DIR
DIR
I/P
TYPE
Analog
FUNCTION
Selects RSSI_OUT pad to source current when unconnected and sink current
when connected to ground.
Connecting this pad to ground causes the RSSI current to be measured from
the photodiode cathode and the PDC regulator to be enabled. This option can
only be used when the PDC pad is connected to the photodiode cathode.
Positive CML output. Positive current into PDA causes voltage to rise on
D
OUT
P pad
Connect to power supply
Connect to power supply
14
RSSI_SEL
I/P
Analog
17
18
20
D
OUT
P
V
CCO
V
CC
O/P
Power
Power
Analog
Supply
Supply
Detailed Description
Photodiode Connection
A PIN photodiode should be connected to the MAX24011
as shown in Figure 1, using the internal voltage reference
to bias the photodiode.
The voltage across the photodiode is equal to V
PDC
minus the base emitter voltage of the input transistor
on the MAX24011, equal to V
PDA
. The anode voltage,
V
PDA
is sensitive to temperature and has a typical value
of 0.85V. To enable the internal regulator, pad 14 (RSSI_
SEL) needs to be bonded to ground.
External connection of a PIN photodiode cathode to an
external power supply can produce inconsistent sensitiv-
ity and bandwidth operation.
If an avalanche photodiode is to be used this is con-
nected as shown in Figure 2, filtering of the bias voltage
must be provided externally to the MAX24011 to avoid
damaging the device. Decoupling of the supply must also
be provided in the optical assembly or host board. The
input current applied to the PDA pad with V
CC
off (< 3.0V)
must not exceed the value given in the maximum ratings,
if exceeded damage may occur to the PDA input circuitry.
Decoupling
For optimum sensitivity performance decoupling of pow-
er-supply noise must be provided on the supply to the
MAX24011 either in the optics assembly or on the main
board that supplies power to the optics. Further decou-
pling and appropriate layout of the RSSI support on the
host board is also recommended to minimize noise injec-
tion into the receive optical assembly.
Transimpedance Amplifier (TIA)
The transimpedance (current to voltage) stage is a very
low noise amplifier with a feedback resistor to set the
gain. This ensures that the output does not overload the
subsequent stage in the signal path.
An internal voltage regulator is used to power the front-
end transimpedance amplifier to improve the rejection of
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