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CAT25C02VA-1.8

产品描述EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, SOIC-8
产品类别存储    存储   
文件大小77KB,共12页
制造商Rochester Electronics
官网地址https://www.rocelec.com/
下载文档 详细参数 选型对比 全文预览

CAT25C02VA-1.8概述

EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, SOIC-8

CAT25C02VA-1.8规格参数

参数名称属性值
厂商名称Rochester Electronics
包装说明SOP,
Reach Compliance Codeunknown
最大时钟频率 (fCLK)1 MHz
JESD-30 代码R-PDSO-G8
JESD-609代码e3
长度4.9 mm
内存密度2048 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数256 words
字数代码256
工作模式SYNCHRONOUS
最高工作温度105 °C
最低工作温度-40 °C
组织256X8
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行SERIAL
座面最大高度1.75 mm
串行总线类型SPI
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)1.8 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度3.9 mm
最长写入周期时间 (tWC)10 ms
Base Number Matches1

文档预览

下载PDF文档
CAT25C01/02/04/08/16
1K/2K/4K/8K/16K SPI Serial CMOS EEPROM
FEATURES
s
10 MHz SPI compatible
s
1.8 to 6.0 volt operation
s
Hardware and software protection
s
Low power CMOS technology
s
SPI modes (0,0 & 1,1)*
s
Commercial, industrial, automotive and
H
LOGEN
FR
A
EE
LE
s
1,000,000 program/erase cycles
s
100 year data retention
s
Self-timed write cycle
A
D
F
R
E
E
TM
s
8-pin DIP/SOIC, 8/14-pin TSSOP and 8-pin MSOP
s
16/32-byte page write buffer
s
Block write protection
extended temperature ranges
– Protect 1/4, 1/2 or all of EEPROM array
DESCRIPTION
The CAT25C01/02/04/08/16 is a 1K/2K/4K/8K/16K Bit
SPI Serial CMOS EEPROM internally organized as
128x8/256x8/512x8/1024x8/2048x8 bits. Catalyst’s
advanced CMOS Technology substantially reduces
device power requirements. The CAT25C01/02/04
features a 16-byte page write buffer. The 25C08/16
features a 32-byte page write buffer.The device operates
via the SPI bus serial interface and is enabled though a
Chip Select (CS). In addition to the Chip Select, the clock
input (SCK), data in (SI) and data out (SO) are required
to access the device. The
HOLD
pin may be used to
suspend any serial communication without resetting the
serial sequence. The CAT25C01/02/04/08/16 is designed
with software and hardware write protection features
including Block Write protection. The device is available
in 8-pin DIP, 8-pin SOIC, 8-pin MSOP and 8/14-pin
TSSOP packages.
PIN CONFIGURATION
TSSOP Package (U14, Y14)
CS
SO
NC
NC
NC
WP
VSS
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VCC
HOLD
NC
NC
NC
SCK
SI
SOIC Package (S, V)
CS
SO
WP
VSS
1
2
3
4
8
7
6
5
VCC
HOLD
SCK
SI
DIP Package (P, L)
CS
SO
WP
VSS
1
2
3
4
8
7
6
5
VCC
HOLD
SCK
SI
TSSOP Package (U, Y)
CS
SO
WP
VSS
1
2
3
4
8
7
6
5
VCC
HOLD
SCL
SI
MSOP Package (R, Z)*
CS
SO
WP
VSS
BLOCK DIAGRAM
SENSE AMPS
SHIFT REGISTERS
1
2
3
4
8
7
6
5
VCC
HOLD
SCK
SI
*CAT25C01/02 only
PIN FUNCTIONS
Pin Name
SO
SCK
WP
V
CC
V
SS
CS
SI
HOLD
NC
WORD ADDRESS
BUFFERS
COLUMN
DECODERS
Function
Serial Data Output
Serial Clock
Write Protect
+1.8V to +6.0V Power Supply
Ground
Chip Select
Serial Data Input
Suspends Serial Input
No Connect
SO
SI
CS
WP
HOLD
SCK
I/O
CONTROL
SPI
CONTROL
LOGIC
BLOCK
PROTECT
LOGIC
CONTROL LOGIC
XDEC
E
2
PROM
ARRAY
DATA IN
STORAGE
HIGH VOLTAGE/
TIMING CONTROL
STATUS
REGISTER
25C128 F02
*Other SPI modes available on request.
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
1
Doc. No. 1016, Rev. N

CAT25C02VA-1.8相似产品对比

CAT25C02VA-1.8 CAT25C02Y14-1.8 CAT25C02Y14I
描述 EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, SOIC-8 EEPROM, 256X8, Serial, CMOS, PDSO14, LEAD AND HALOGEN FREE, TSSOP-14 EEPROM, 256X8, Serial, CMOS, PDSO14, LEAD AND HALOGEN FREE, TSSOP-14
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics
包装说明 SOP, TSSOP, TSSOP,
Reach Compliance Code unknown unknown unknown
最大时钟频率 (fCLK) 1 MHz 1 MHz 5 MHz
JESD-30 代码 R-PDSO-G8 R-PDSO-G14 R-PDSO-G14
JESD-609代码 e3 e3 e3
长度 4.9 mm 5 mm 5 mm
内存密度 2048 bit 2048 bit 2048 bit
内存集成电路类型 EEPROM EEPROM EEPROM
内存宽度 8 8 8
功能数量 1 1 1
端子数量 8 14 14
字数 256 words 256 words 256 words
字数代码 256 256 256
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 105 °C 70 °C 85 °C
最低工作温度 -40 °C - -40 °C
组织 256X8 256X8 256X8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 SERIAL SERIAL SERIAL
座面最大高度 1.75 mm 1.1 mm 1.1 mm
串行总线类型 SPI SPI SPI
最大供电电压 (Vsup) 6 V 6 V 6 V
最小供电电压 (Vsup) 1.8 V 1.8 V 2.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING GULL WING GULL WING
端子节距 1.27 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL
宽度 3.9 mm 3 mm 3 mm
最长写入周期时间 (tWC) 10 ms 10 ms 5 ms
Base Number Matches 1 1 1

 
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