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SVHB21V105K

产品描述CAPACITOR, TANTALUM, SOLID, POLARIZED, 35V, 1uF, SURFACE MOUNT, 1411, CHIP
产品类别无源元件    电容器   
文件大小58KB,共3页
制造商NEC TOKIN ( KEMET Corporation )
官网地址http://www.kemet.com
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SVHB21V105K概述

CAPACITOR, TANTALUM, SOLID, POLARIZED, 35V, 1uF, SURFACE MOUNT, 1411, CHIP

SVHB21V105K规格参数

参数名称属性值
包装说明, 1411
Reach Compliance Codeunknown
ECCN代码EAR99
电容1 µF
电容器类型TANTALUM CAPACITOR
介电材料TANTALUM (DRY/SOLID)
漏电流0.0005 mA
制造商序列号SV/H
安装特点SURFACE MOUNT
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法BULK
极性POLARIZED
正容差10%
额定(直流)电压(URdc)35 V
尺寸代码1411
表面贴装YES
Delta切线0.04
端子形状WRAPAROUND
Base Number Matches1

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SV/H Series
SV/H Series Tantalum Chip Capacitors
(Higher Performance)
DIMENSIONS [mm]
L
L
W
1
W
1
L
W
1
Y
PERFORMANCE CHARACTERISTICS
Operating temperature range
−55
to +125°C with proper voltage
derating as shown in the following table.
DC working voltage and surge voltage
H
H
W
2
W
2
W
2
H
Rated voltage
Working
at 85°C
10
10
16
16
10
20
20 25
20 25
13 16
26 33
35
35
22
46
V
V
V
V
Z
Z
Z
[A cases]
Z
[B2 cases]
Z
Z
[C, D2 cases]
at 125°C 6.3
at 85°C
13
Surge
(Unit: mm)
Case
EIA code
Code
A
B2
C
D2
3216
3528
6032
5846
L
3.2
±
0.2
3.5
±
0.2
6.0
±
0.2
5.8
±
0.2
W
1
1.6
±
0.2
2.8
±
0.2
3.2
±
0.2
4.6
±
0.2
W
2
1.2
±
0.1
2.3
±
0.1
2.2
±
0.1
2.4
±
0.1
H
1.6
±
0.2
1.9
±
0.2
2.5
±
0.2
3.2
±
0.2
Z
0.8
±
0.2
0.8
±
0.2
1.3
±
0.2
1.3
±
0.2
Y
0.4 C
Capacitance (at 20°C, 120 Hz)
Range:
0.47
µ
F to 33
µ
F
Tolerance:
±20%, ±10%
Capacitance change with temperature
Not to exceed
−12%
at
−55°C,
+12%
at 85°C, and +15% at 125°C
Tangent of loss angle (at 20°C, 120 Hz)
0.47
µ
F to 4.7
µ
F: less than 0.04
6.8
µ
F to 33
µ
F: less than 0.06
DC leakage current (at 20°C)
0.01 C
V
Note
µ
A or 0.5
µ
A, whichever is greater
Damp heat (85% RH at 85°C, 56 days (1344 h))
Capacitance change:
±10%
Tangent of loss angle: 150% of
initial requirements
DC leakage current:
initial requirements
Endurance (at 85°C, DC rated voltage, 2000 h)
Capacitance change:
±10%
Tangent of loss angle: initial requirements
DC leakage current:
125% of
initial requirements
Resistance to soldering heat
(solder reflow and solder dip at 260°C, 10 s.)
Capacitance change:
±
5%
Tangent of loss angle: initial requirements
DC leakage current:
initial requirements
Rapid change of temperature (at
−55
to 125°C,
1000 cycles)
Capacitance change:
±
10%
Leakage current:
initial requirements
Tangent of loss angleL initial requirements
Note:
Product of capacitance in
µ
F and voltage in V.
µ
F
DC rated
voltage
(Vdc)
10
16
20
25
A
35
B2
B2
B2
0.47
0.68
1
1.5
2.2
3.3
4.7
6.8
10
15
22
33
D2
C
D2
C
D2
B2
C
A
B2
A
A
B2
A
B2
C
C
C
C
D2
D2
D2
See pages 25 and 26 for taping specifications.
17

 
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