FEATURES
APPLICATIONS
Operating Temperature Range
Capacitance Tolerance
Peak, AC voltage (50/60 Hz)
Dissipation Factor (MAX)
25°C
Insulation Resistance
@25°C (<70% RH)for 1 minute at
100VDC applied
Small Size
–
Low ESR
-
General Purpose
General Purpose
–
Bypass
–
Coupling
–
Blocking
-40°C to +105°C
+10% at 1 kHz, 25°C
+5% optional
WVDC
50
63
100
250
400
630
1000
1500
VAC
30
40
63
160
200
220
250
300
For T>+85°C , The voltage must be decreased by 1.25% per °C
Frequency (kHz)
C<0.1uF
0.1uF<C<1.0uF
C>1.0uF
1
0.80%
1.00%
1.00%
10
1.50%
1.50%
-
100
2.50%
-
-
WVDC
Capacitance
Insulation Resistance
<100WVDC
<0.33μF
15000 MΩ
>100WVDC
<0.33μF
30000 MΩxμF
<100WVDC
>0.33μF
15000 MΩxμF
>100WVDC
>0.33μF
10000 MΩxμF
2000 Hours, +85C with 125% of rated voltage
Capacitance Change
<5% of initially measured value
<0.005 at 1kHz and 25°C for C<1uF
Dissipation Factor
<0.005 at 1kHz and 25°C For C>1uF
Insulation Resistance
>50% of maximum specified value
56 days at40°C with 93%RH(+/-2%), +40°C and no voltage applied
Capacitance Change
<5% of initially measured value
Dissipation Factor
<0.005 at 1kHz and 25°C
Insulation Resistance
>50% of maximum specified value
<1 nano-Henry per mm of body length and lead length
<1.0% after 2 years at 40°C
+400 ppm/°C, +200ppm/°C
Terminal to Terminal
160% of VDC applied for 2 Seconds and 25°C
Polyester
Metallized film Internal series connected (>1000WVDC)
Flame Retardant Polyester tape wrap (UL 510) with epoxy resin end fills(UL94V0)
Lead free tinned copper leads
Load Life
Damp Heat test
Self Inductance
Capacitance Drift Factor
Capacitance Temperature
Coefficient
Dielectric Strength
Dielectric
Construction
Coating
Leads
Lead Diameter
D
d
<9
0.6
9<D<20
0.8
>20
1.0
Jul-17
NXP MCU
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