New
Subminiature Surface-Mount Package
SSS Mini 2-Pin Package Series
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Overview
The Subminiature Surface-Mount Package Series with 1.0 mm x 0.6 mm x 0.52 mm in external size allows high-
density mounting. In addition, the flat-lead structure of the package ensures stable mounting quality with less
mounting effort.
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Feature
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Allowing high-density mounting.
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Flat-lead structure supporting high-speed mounting.
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Applications
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Cellular phones, personal handy-phone system (PHS) sets, and VCO, VCXO, TCXO, and antenna switches for
cordless telephones
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A variety of portable products
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Package
0.15min
Variable capacitance diode
0.27
+0.05
Ð0.02
K
0.16
+0.10
Ð0.06
PIN diode
0.60
±0.05
1
0.12
+0.05
–0.02
1.00
±0.05
1.14
±0.05
1.00
±0.05
1.40
±0.05
5û
0.60
±0.05
A
5û
min0.15
2
0.27
+0.05
–0.02
5˚
0 to 0.1 0.52
±0.03
0.52
±0.03
5˚
max0.15
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Recommended Mounting Dimensions
1.3
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Packing Specification
SSS Mini 2-Pin Package
10,000pcs
(4-mm pitch)
0.3
0.3
The products and specification are subject to change without any notice. Please ask for the latest Product Standards to guarantee the satisfaction of your product requirements.
1.Kotari Yakemachi, Nagaokakyo, Kyoto, 617-8520 Japan
M00429AE
0.4
Tel. (075)951-8151
0 to 0.01
http://www.mec.panasonic.co.jp
New publication, effective from Sep.1 2000.
0.15max
0.15min
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