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C460MB290-0208

产品描述Single Color LED, White,
产品类别光电子/LED    光电   
文件大小253KB,共7页
制造商Cree(科瑞)
官网地址http://www.cree.com/
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C460MB290-0208概述

Single Color LED, White,

C460MB290-0208规格参数

参数名称属性值
Reach Compliance Codeunknown
颜色WHITE
最大正向电流0.03 A
安装特点SURFACE MOUNT
功能数量1
最高工作温度100 °C
最低工作温度-40 °C
光电设备类型SINGLE COLOR LED
包装方法BULK
形状SQUARE
表面贴装YES
Base Number Matches1

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MegaBright
®
Generation II LEDs
CxxxMB290-Sxx00
Cree’s MB™ Generation II series of MegaBright LEDs combine highly efficient InGaN materials with Cree’s
proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a
geometrically enhanced vertical chip structure to maximize light extraction efficiency and require only a single wire
bond connection. Sorted die kits provide die sheets conveniently sorted into wavelength and radiant flux bins. Cree’s
MB series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000V
ESD. These LEDs are useful in a broad range of applications such as outdoor full-motion LED video signs, automotive
lighting and white LEDs, yet can also be used in high-volume applications such as LCD backlighting. Cree’s MB series
chips are compatible with most radial and SMT LED assembly processes.
FEATURES
MegaBright LED Performance
460 & 470nm
MB-8 – 8.0 mW min.
MB-10 - 10.0 mW min.
MB-12 - 12.0 mW min.
MB-14 - 14.0 mW min.
MB-16 - 16.0 mW min (460 nm)
APPLICATIONS
White LEDs
LCD Backlighting Units
Outdoor LED Video Displays
Automotive Dashboard Lighting
Traffic Signals
505 nm - 6.0 mW min.
527 nm - 5.0 mW min.
Single Wire Bond Structure
Class 2 ESD Rating
CxxxMB290-Sxx00 Chip Diagram
Top View
G•SiC LED Chip
300 x 300 μm
Mesa (junction)
250 x 250 μm
Gold Bond Pad
112 μm Diameter
Bottom View
Die Cross Section
InGaN
Anode (+)
C
PR3CK, Rev.
Datasheet: C
SiC Substrate
h = 250 μm
Backside
Metallization
Cathode (-)
Subject to change without notice.
www.cree.com


 
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