Power Management Circuit, CMOS, CDIP8,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-XDIP-T8 |
| JESD-609代码 | e0 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 最大供电电流 (Isup) | 10 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MAX690MJA/HR | MAX690CSA | MAX690MDA | MAX690MJA/883 | MAX694MJA/883 | MAX695EWE-TR | MAX695MJE/HR | MAX692MJA/883 | MAX692MJA/HR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Power Management Circuit, CMOS, CDIP8, | Power Management Circuit, CMOS, PDSO8, | Power Management Circuit, CMOS, CDIP8 | Power Management Circuit, CMOS, CDIP8, | Power Supply Management Circuit, CMOS, CDIP8, | Power Management Circuit, CMOS, PDSO16 | Power Management Circuit, CMOS, CDIP16 | Power Supply Management Circuit, CMOS, CDIP8, | Power Management Circuit, CMOS, CDIP8, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-XDIP-T8 | R-PDSO-G8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-PDSO-G16 | R-XDIP-T16 | R-XDIP-T8 | R-XDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 16 | 16 | 8 | 8 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | SOP | DIP | DIP | DIP | SOP | DIP | DIP | DIP |
| 封装等效代码 | DIP8,.3 | SOP8,.25 | DIP8,.3 | DIP8,.3 | DIP8,.3 | SOP16,.4 | DIP16,.3 | DIP8,.3 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大供电电流 (Isup) | 10 mA | 10 mA | 10 mA | 10 mA | 15 mA | 10 mA | 10 mA | 15 mA | 10 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | NO | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) | - | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) |
| 厂商名称 | - | - | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
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