F-211
SS4–40–3.00–L–D–K–TR
ST4–20–1.00–L–D–P–TR
SS4–20–3.00–L–D–K–TR
ST4–40–1.00–L–D–P–TR
(0,40mm) .01575"
SS4, ST4 SERIES
ULTRA FINE PITCH HEADER & SOCKET
SS4 Mates with:
ST4
ST4 Mates with:
SS4
SS4
POSITIONS
PER ROW
LEAD
STYLE
PLATING
OPTION
D
K
TR
(Required
in callout)
SPECIFICATIONS
For complete specifications
and recommended PCB layouts
see www.samtec.com?SS4 or
www.samtec.com?ST4
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
1.3A @ 80°C ambient
RoHS Compliant:
Yes
–3.00
–10, –20,
–30, –40, –50
= 3.00mm
–L
= 10µ" (0,25µm)
Gold on contact,
Matte Tin on tail
–3.50
= 3.50mm
(Required
in callout)
–TR
= Tape &
Reel
–K
= (3,51mm)
.138" DIA
Polyimide
Film Pick &
Place Pad
No. of positions x
(0,40) .01575 + (3,54) .139
(4,35)
.171
LEAD
STYLE
A
B
–3.00
(2,85) (3,50)
.112 .138
–3.50
(3,35) (4,00)
.132 .157
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max
B
(0,15) .006
(0,40) .01575
(5,00)
.197
A
MATED HEIGHT
ST4
SS4
MATED
HEIGHT
4mm Stack
Rated @ 3dB
Height
Insertion Loss
Single-Ended 7.0 GHz / 14 Gbps
Signaling
Differential
Pair Signaling 4.5 GHz / 9 Gbps
Complete test data available
at www.samtec.com?SS4,
www.samtec.com?ST4 or
contact sig@samtec.com
ST4
POSITIONS
PER ROW
LEAD
STYLE
PLATING
OPTION
D
P
TR
(Required
in callout)
MATED HEIGHT*
ST4
LEAD
STYLE
SS4 LEAD STYLE
–1.00
–10, –20,
–30, –40, –50
= 1.00mm
–L
= 10µ" (0,25µm)
Gold on contact,
Matte Tin on tail
–3.00
(4,00) .157
(4,50) .177
(5,50) .217
–3.50
(4,50) .177
(5,00) .197
(6,00) .236
–1.50
= 1.50mm
(Required
in callout)
–TR
= Tape &
Reel
–1.00
–1.50
–2.50
–P
= Pick &
Place Pad
–2.50
= 2.50mm
*Processing conditions will
affect mated height.
No. of positions x
(0,40) .01575 + (1,58) .062
(3,70)
.146
LEAD
STYLE
A
B
–1.00
(1,00) (3,08)
.039 .121
–1.50
–2.50
(1,50) (3,58)
.059 .141
(2,50) (4,58)
.098 .180
B
A
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
(0,20) .008
(0,40) .01575
(4,00)
.157
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