电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

RNB013-01TT

产品描述IC Socket, SIP13, 13 Contact(s),
产品类别连接器    插座   
文件大小318KB,共4页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

RNB013-01TT概述

IC Socket, SIP13, 13 Contact(s),

RNB013-01TT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Reach Compliance Codecompliant
ECCN代码EAR99
联系完成配合TIN LEAD OVER NICKEL
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点材料BERYLLIUM COPPER
设备插槽类型IC SOCKET
使用的设备类型SIP13
外壳材料LIQUID CRYSTAL POLYMER
JESD-609代码e0
触点数13
Base Number Matches1

文档预览

下载PDF文档
SIP Sockets
Table of Models
SIP Sockets
Molded and Peel-A-Way
Description:
Peel-A-Way
®
(KSS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
®
.005 Typ.
(.13)
Description:
Molded Snap Strips (RSS, RLSS)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.030 Typ.
(.76)
.095 Typ.
(2.41)
.095 Typ.
(2.41)
Head Above
Plastic
Head Flush
with Plastic
.095 Typ.
(2.41)
Features:
• Available in three body types:
Peel-A-Way
®
Removable Terminal
Carriers, molded Solid Strips, and
molded Snap Strips [breakable at
.100/(2.54mm)].
• Tapered entry for ease of
insertion.
• Multi-finger contacts for reliability.
• Closed bottom sleeve for 100%
anti-wicking of solder.
• Custom configurations available.
Description:
Molded Solid Strips (RNB, RLNB)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.030 Typ.
(.76)
.095 Typ.
(2.41)
Head Above
Plastic
Head Flush
with Plastic
RSS/RLSS replaces HSS/HLSS and SS/LSS
RNB/RLNB replaces HNB/HLNB and NB/LNB
Options
Tape Sealant - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
• Material - Silicone Backed Polyimide Film, -74°C to 260°C (-100°F
to 500°F) Intermittent to 371°C (700°F)
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Dimensional Information
Molded
Body Types
.100 Typ.
(2.54)
.100
(2.54)
A
.095
.100 Typ.
(2.54)
A Dimension = number of pins X .100/(2.54)
.100
(2.54)
Peel-A-Way
®
Body Types
A
A Dimension = [number of pins X .100/(2.54)] + .200/(5.08)
How To Order
KSS
Body Type
RoHS Compliant:
032
-85
M
G
Contact Plating
RoHS Compliant:
KSS - Peel-A-Way
RSS - Molded Snap (head above)
RLSS - Molded Snap (head flush)
RNB - Molded Solid (head above)
RLNB - Molded Solid (head flush)
Number of Pins
KSS: 2-100 pos.
RSS/RLSS: 20, 30 or 32 pos.
RNB/RLNB: 3-20, 30 or 32 pos.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Cat. 16 Rev. 2
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
MSP430BSL下载线原理图,PL2303+74HC04
MSP430BSL下载线原理图,PL2303+74HC04 79115...
wm20031015 微控制器 MCU
修正FPC底片变形相关方法的注意事项
1、剪接法:  适用:线路不太密集,各层底片变形不一致的底片;对阻焊底片及多层板电源地层底片的变形尤为适用;   不适用:导线密度高,线宽及间距小于0.2mm的底片;   注意事 ......
方学放 PCB设计
Atmel发布最新固件,JTAGICE3支持全部Cortex-M芯片!
官网消息,Atmel发布了JTAGICE3的固件Firmware Version 3+,升级固件后的JTAGICE3将可以调试所有Cortex-M芯片。 支持JTAG、SWD和ITM trace: Supports programming and debugging of all SAM A ......
zhangchaoying Microchip MCU
DS1307电子万年历问题
请问谁有关于用DS1307做的电子时钟控制的程序,是基于51单片机的,可以显示和通过按键设置时间的!!!!!!...
lytton50 嵌入式系统
【R7F0C809】第二篇--上电初体验
拿到开发板,第一件事当然是上电体验啊,今年和去年的还是一样,demo板上还是预留着很多的空白,需要我们自己去焊接,不过这个调试的EZ-CUBE还是那么迷你,那么可爱,今天我们就首先来 ......
陌路绝途 瑞萨MCU/MPU
????。。。VHDL语言。。。不懂 拜托帮下忙
那位大哥帮忙解释下这段代码。。。。非常感谢:) LIBRARY ieee; USE ieee.std_logic_1164.all; USE ieee.std_logic_arith.all; ENTITY mult19 is PORT ( clk : IN STD_LOGIC; Din : IN ......
doumaggie DSP 与 ARM 处理器

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1527  310  122  2701  2886  6  45  57  5  13 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved