Multiplexer, 1-Func, 8 Line Input, CMOS, PDSO16,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | SOP, SOP16,.25 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | MULTIPLEXER |
最大I(ol) | 0.024 A |
功能数量 | 1 |
输入次数 | 8 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | TAPE AND REEL |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 16.9 ns |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
CD74ACT151M96 | CD54ACT151F/3A | CD54AC151F | CD74AC151EX | CD74ACT151EX | CD74ACT151M | CD74ACT151E | |
---|---|---|---|---|---|---|---|
描述 | Multiplexer, 1-Func, 8 Line Input, CMOS, PDSO16, | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16 | Multiplexer, AC Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CDIP16, DIP-16 | Multiplexer, 1-Func, 8 Line Input, CMOS, PDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, PDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, PDSO16, | Multiplexer, 1-Func, 8 Line Input, CMOS, PDIP16, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP-16 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
JESD-30 代码 | R-PDSO-G16 | R-XDIP-T16 | R-CDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
最大I(ol) | 0.024 A | 0.024 A | 0.012 A | 0.012 A | 0.024 A | 0.024 A | 0.024 A |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIP | DIP | DIP | SOP | DIP |
封装等效代码 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 5 V | 5 V | 3.3/5 V | 3.3/5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Prop。Delay @ Nom-Sup | 16.9 ns | 16.9 ns | 20.9 ns | 20.9 ns | 16.9 ns | 16.9 ns | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
厂商名称 | - | - | RCA | RCA | RCA | RCA | RCA |
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