Bi-Directional FIFO, 2KX36, 30ns, Synchronous, CMOS, PQFP144,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Reach Compliance Code | unknown |
最长访问时间 | 30 ns |
其他特性 | RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX |
最大时钟频率 (fCLK) | 33 MHz |
周期时间 | 30 ns |
JESD-30 代码 | S-PQFP-G144 |
JESD-609代码 | e0 |
内存密度 | 73728 bit |
内存集成电路类型 | BI-DIRECTIONAL FIFO |
内存宽度 | 36 |
功能数量 | 1 |
端子数量 | 144 |
字数 | 2048 words |
字数代码 | 2000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2KX36 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP144,.87SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.001 A |
最大压摆率 | 0.28 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
QS723621-30TF | QS723611-30TF | QS723621-20TF | QS723611-20TF | QS723611-25TF | QS723621-25TF | |
---|---|---|---|---|---|---|
描述 | Bi-Directional FIFO, 2KX36, 30ns, Synchronous, CMOS, PQFP144, | Bi-Directional FIFO, 1KX36, 20ns, Synchronous, CMOS, PQFP144, | Bi-Directional FIFO, 2KX36, 20ns, Synchronous, CMOS, PQFP144, | Bi-Directional FIFO, 1KX36, 13.8ns, Synchronous, CMOS, PQFP144, | Bi-Directional FIFO, 1KX36, 16ns, Synchronous, CMOS, PQFP144, | Bi-Directional FIFO, 2KX36, 25ns, Synchronous, CMOS, PQFP144, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknow | unknow | unknow |
最长访问时间 | 30 ns | 20 ns | 20 ns | 13.8 ns | 16 ns | 25 ns |
其他特性 | RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX | RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX | RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX | RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX | RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX | RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX |
最大时钟频率 (fCLK) | 33 MHz | 33 MHz | 50 MHz | 50 MHz | 40 MHz | 40 MHz |
周期时间 | 30 ns | 30 ns | 20 ns | 20 ns | 25 ns | 25 ns |
JESD-30 代码 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 73728 bit | 36864 bit | 73728 bit | 36864 bi | 36864 bi | 73728 bi |
内存集成电路类型 | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO |
内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 144 | 144 | 144 | 144 | 144 | 144 |
字数 | 2048 words | 1024 words | 2048 words | 1024 words | 1024 words | 2048 words |
字数代码 | 2000 | 1000 | 2000 | 1000 | 1000 | 2000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 2KX36 | 1KX36 | 2KX36 | 1KX36 | 1KX36 | 2KX36 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
封装等效代码 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | QFP144,.87SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
最大压摆率 | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | - | Quality Semiconductor Inc | Quality Semiconductor Inc | Quality Semiconductor Inc | Quality Semiconductor Inc | Quality Semiconductor Inc |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved