电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TSH-111-05-F-DV-LC

产品描述Board Connector, 22 Contact(s), 2 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Black Insulator,
产品类别连接器    连接器   
文件大小195KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

TSH-111-05-F-DV-LC概述

Board Connector, 22 Contact(s), 2 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Black Insulator,

TSH-111-05-F-DV-LC规格参数

参数名称属性值
Reach Compliance Codecompliant
ECCN代码EAR99
主体宽度0.207 inch
主体深度0.23 inch
主体长度1.024 inch
连接器类型BOARD CONNECTOR
联系完成配合AU ON NI
触点性别FEMALE
触点模式RECTANGULAR
触点样式SQ PIN-SKT
绝缘体颜色BLACK
绝缘体材料LIQUID CRYSTAL POLYMER (LCP)
插接触点节距0.079 inch
匹配触点行间距0.079 inch
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度125 °C
最低工作温度-55 °C
PCB接触模式RECTANGULAR
PCB触点行间距4.3688 mm
电镀厚度FLASH inch
参考标准UL
可靠性COMMERCIAL
端子节距2.0066 mm
端接类型SURFACE MOUNT
触点总数22
Base Number Matches1

文档预览

下载PDF文档
REVISION R
DO NOT
SCALE FROM
THIS PRINT
.118 REF
02
TSH-1XX-XX-XX-DX-XX
((No OF POS +2) x .07874) .010
C
(No OF POS -1)
x .07874
No OF POSITIONS
-05 THRU -48
(PER ROW)
LEAD STYLE
-01: .126 (USE T-1S13-07-XX-2)
-04: .075 (USE T-1S13-04-XX-2)
-05: .065 (USE T-1S13-20-XX-2)
.203 REF
.112
REF
01
.07874 REF
.158 REF
PLATING SPECIFICATION
OPTION
-LC: LOCKING CLIP (-DV ONLY)
(USE LC-09-TM)
(SEE FIG 3, SHEET 2, SEE NOTE 14)
-A: ALIGNMENT PIN (-DV ONLY)
(USE TMSH-XX-D-ES-XX-A)
(SEE FIG 3, SHEET 2)
*-M: METAL PICK & PLACE PAD
(-DV ONLY, USE LMP-04)
(SEE FIG 4, SHEET 2)
-TR: TAPE & REEL
(34 POSITION MAX ,-DV ONLY)
ROW SPECIFICATION (SEE NOTE 12)
-D: DOUBLE THROUGH (SEE FIG 2)
(USE TMSH-XX-D-ES)
-DV: DOUBLE VERTICAL (SEE FIG 1)
(USE TMSH-XX-D-ES)
* = FOR EXISTING CUSTOMERS ONLY
.020 SQ REF
((No OF POS x .07874)
+ .023) REF
.051 REF
FIG 1
TSH-105-01-XX-DV SHOWN
TMSH-XX-D-XX-ES
2 MAX SWAY
(ANY DIRECTION)
-G: 20µ" GOLD IN CONTACT AREA, 3µ" ON TAIL
-T: MATTE TIN CONTACT AND TAIL
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL
-L: 15µ" LIGHT SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL
-H: 30µ" HEAVY GOLD IN CONTACT AREA, 3µ" ON TAIL
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL
-TM: MATTE TIN CONTACT AND TAIL
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL
-LM: 15µ" LIGHT SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL
-FM: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL
CONTACT AREA
(SEE NOTE 9)
C
"A"
.210 REF
.079 REF
T-1S13-XX-XX-2
"A"
.0060
C
90°±3°
"A"
C
"B"
.081
C
.060 REF
.277±.010
(SEE NOTE 10)
TSH-105-01-XX-D SHOWN
"A"
"L"
REF
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. COPLANARITY TO BE WITHIN .0060.
3. BURR ALLOWANCE: .0015 MAX.
4. MAXIMUM CUT FLASH: .020.
5. MINIMUM PUSHOUT FORCE: 1.0 LB.
6. MAXIMUM ALLOWABLE BOW: .002 INCH/INCH AFTER ASSEMBLY.
7. MEASURED AT BEND RADIUS, NOT AT TIP OF PIN.
8. ALL POSITIONS AND ALL OPTIONS TO BE TUBED.
9. GOLD PLATING TO BE ON POST, TIN PLATING ON TAIL (ONLY APPLIES
TO SELECTIVE PLATING OPTIONS).
10. SURFACE MOUNT STYLE -05: TAILS TO BE SHEARED TO ACHIEVE DIM.
11. PRINT CREATED FROM TMSH-ASM REVISION E. SEE TMSH-ASM FOR
REVISION HISTORY.
12. SEE TSH-1XX-XX-X-XX-XX FOR -DH & -RA ROW SPECIFICATIONS.
C
13. ORIENTATE PINS TO REDUCE THE NUMBER OF BANDOLIER MARKS IN
THE POST AREA. (SEE TABLE 2).
14. DUE TO THE HIGH AMOUNT OF INSERTION FORCE NEEDED, THE -LC
OPTION IS NOT COMPATIBLE WITH AUTO PLACEMENT. SAMTEC
RECOMMENDS MANUAL PLACEMENT FOR ALL ASSEMBLIES WITH THE
-LC OPTION.
FIG 2
.099
- .002
(SEE NOTE 7)
+.005
IN-PROCESS (-DV)
SECTION "A"-"A"
STYLE -05 IN-PROCESS (-DV)
"B"
C
.144±.010
(SEE NOTE 10)
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01
.XXX: .005
.XXXX: .0020
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2.5:1
INSULATOR: LCP, UL 94 VO
COLOR: BLACK
TERMINAL: PHOS BRONZE, ALLOY No 510
F:\DWG\MISC\MKTG\TSH-1XX-XX-XX-DX-XX-MKT.SLDDRW
2mm END SHROUD TERMINAL ASSEMBLY
TSH-1XX-XX-XX-DX-XX
07-02-2010
SHEET
1
OF
2
BY:
DEAN P
STN液晶显示原理
本帖最后由 jameswangsynnex 于 2015-3-3 20:00 编辑 STN液晶显示原理STN型的显示原理与TN相类似,不同的是TN扭转式向列场效应的液晶分子是将入射光旋转90度,而STN超扭转式向列场效应是将入射 ......
gaoyanmei 消费电子
三防胶怎么去?
想拆下来板子上的接插件,。但刷了三防胶,电烙铁熔不了,于是先把锡丝覆盖,慢慢熔,大的方形片状的引脚插件拆下来了,但是圆形针状的小引脚有的熔不开,锡跑到背面去了,焊盘都被我焊坏了,弄 ......
大发明家 PCB设计
在CE上如何实现网络共享
在PCC上可以用NetShareAdd、NetShareEnum等函数来创建网络共享 在CE上,这些函数不能用,那要怎么实现? 请有做过的,各位大哥大姐帮帮忙, 小弟再些表示感谢!...
uoy1984 嵌入式系统
TIVA Launchpad 一:重看讲座并收到板子
按周计划又看了一下讲座有如下几点笔记: 1、 VDD3ON 在休眠下能使管脚保持状态。2、 退出休眠状态可以用RTC或者唤醒管脚。3、 内含USB2.0/OTG/HOST/DEVICE4、 ADC含有硬件均值器5、 GPIO可以 ......
ddllxxrr 微控制器 MCU
blackbox 生成方法求教
各位大虾: 哪个知道怎样把VHDL或VERILOG 代码转换成 网表级的代码给别人调用? 例如: 在ISE 综合器下怎么转? QUARTUS 综合器下怎么转? LATTICE 综合器下怎么转?...
eeleader FPGA/CPLD
没有板子的朋友看过来:五月更精彩!下次学习活动即将展开。
至此,本期免费赠送开发板的活动已经结束,当然,大家的项目都很优秀,但是由于板子数量有限,我们也在很努力地为大家争取更多的机会,每次得知可以多一些板子时,办公室里的同事比谁都高兴。我 ......
EEWORLD社区 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1390  653  671  2876  464  39  5  56  26  34 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved