FEATURES
Metallized Polypropylene
-
High Capacitance
–
Low ESR
APPLICATIONS
Switching Power Supplies
–
UPS
–
DC Link
–
Motor Speed Controls
–
Solar Heaters
–
Power Converters
-40°C to +100°C
Above +85°C applied voltage must be de-rated by 1.5%/°C
+10% at 1 kHz, 25°C
+5% optional
400
600
700
850
600
400
250
5uF<C<2
5uF
.1%
800
600
330
1000
700
400
C>75uF
.15%
30000 MΩxuF
“Not to exceed 3GΩ”
<1 nano-Henry per mm of lead spacing
Capacitance variation <1% MAX after 2 years
Terminal to Terminal
Terminal to case
160% of VDC VDC applied for 10
Seconds and 25°C or
3KVAC at 50/60 Hz applied between the terminals and
200% of VDC applied for 2 Seconds
case for 60 Seconds and 25°C
and 25°C
>100000 with VDC
>30000 with VAC
300/billion component hours
Test Condition
Performance requirements
Temperature= +40°C +2°C
Relative Humidity=93 +2%
Test length= 56 days
Max Capacitance change
DF Change
Insulation resistance
< 2% of initially measured valued
< 200% of initially specified valued
> 50% of minimum specified value
Operating Temperature Range
Capacitance Tolerance
Surge Voltage
VDC
Non-repetitive
SVDC
VDC
VAC
Dissipation Factor (MAX)
Tan δ
at 1 kHz and 25°C
Insulation Resistance
After 1 minute of 100VDC applied
between the terminals at 25°C
Self Inductance
Long term stability
250
400
250
160
330
400
330
220
1200
850
500
AC voltage
C< 5uF
.06%
Dielectric Strength
Life Expectancy
Failure quota
Damp Heat Test
Resistance to soldering Heat
Solder bath temperature: +260°C +/- 5°C
Exposure time: 10 seconds +/- 1 second
Max Capacitance change
DF Change
Insulation resistance
Construction
Electrodes
Coating
Lead terminations
<1% of initially measured value
< .1% at 1kHz
>50% of minimum specified value
Metallized Polypropylene film
Vacuum deposited Metal layers
Flame retardant tape wrap (UL510) with epoxy end fill (UL94V-0)
Lead free tinned copper leads
Nov-18
NXP MCU
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