NAND Gate, CMOS, CDIP14
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
逻辑集成电路类型 | NAND GATE |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | OPEN-DRAIN |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5/15 V |
认证状态 | Not Qualified |
施密特触发器 | NO |
筛选级别 | MIL-STD-883 Class B (Modified) |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
CD40107BD/3 | CD40107BEX | CD40107BEX98 | CD40107BE98 | CD40107BD/3W | CD40107BFX | CD40107BF/3W | CD40107BF/3 | |
---|---|---|---|---|---|---|---|---|
描述 | NAND Gate, CMOS, CDIP14 | NAND Gate, CMOS, PDIP8, | NAND Gate, CMOS, PDIP8, | NAND Gate, CMOS, PDIP8, | NAND Gate, CMOS, CDIP14 | NAND Gate, CMOS, CDIP14, | NAND Gate, CMOS, CDIP14 | NAND Gate, CMOS, CDIP14 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP14,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDIP-T14 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
端子数量 | 14 | 8 | 8 | 8 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
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