F-219 SUPPLEMENT
SC–8P1–GT
SC–1P4–GG
SC, T SERIES
MACHINED TERMINALS & SOCKETS
SPECIFICATIONS
SC
Contact:
BeCu
Shell:
Brass
-GG Plating:
30 µ" (0.76 µm) Au over
50 µ" (1.27 µm) Ni on contact;
10 µ" (0.25 µm) Au over
50 µ" (1.27 µm) Ni on shell
-GT Plating:
30 µ" (0.76 µm) Au over
50 µ" (1.27 µm) Ni on contact;
Sn over 50 µ" (1.27 µm) Ni
on shell
-TT Plating:
Sn over 50 µ" (1.27 µm)
Ni on contact; Sn over
50 µ" (1.27 µm) Ni on shell
-ST Plating:
10 µ" (0.25 µm) Au over
50 µ" (1.27 µm) Ni on contact;
Sn over 50 µ" (1.27 µm)
Ni on shell
Lead DIA Accepted:
(0.38 mm) .015" to
(0.56 mm) .022" and
most IC leads
SC–1P1–, SC–6P1–
SC–8P1
(1.83)
.072
DIA
(1.52)
.061
DIA
(0.76)
.030
(1.83)
.072
DIA
(2.11)
(0.25)
.083
.010
(1.32)
.052
DIA
(0.74)
.029 DIA
Part No.
SC–1P1–
SC–6P1–
DIA ±.010 ±.015
(0.51) (3.18) (7.62)
.020 .125 .300
(0.51) (4.57) (8.89)
.020 .180 .350
X
Y
Z
(0.71)
.028
(4.19)
.165
(1.32)
.052
DIA
Z
Y
X
DIA
SPECIFICATIONS
Insertion Depth (SC-1P1, SC-6P1) = (2.41 mm) .95" to (3.68 mm) .145"
Plating Available (SC-1P1) = GG, GT, TT, ST
Plating Available (SC-6P1) = GG, GT
Insertion Depth = (2.16 mm) .085" to .140" (3.56 mm)
Lead DIA Accepted: (0.41 mm) .016" to (0.51 mm) .020"
Plating Available = GG, GT, TT
SC-1P4
Contact:
BeCu
Shell:
Brass
-GG Plating:
20 µ" (0.51 µm) Au over
50 µ" (1.27 µm) Ni on contact
-GT Plating:
20 µ" (0.51 µm) Au over
50 µ" (1.27 µm) Ni on contact
Insertion Force:
6.5 oz (1.81 N) avg,
13 oz (3.62 N) max
(.032" (0.81 mm) DIA probe)
Withdrawal Force:
3 oz (0.83 N) avg,
2 oz (0.56 N) min
(.032" (0.81 mm) DIA probe)
SC–1P4–
T–1S6–
PART NO.
B
(10.92) .430
(13.46) .530
(18.54) .730
(21.08) .830
(23.62) .930
(26.16) 1.030
(31.24) 1.230
(36.32) 1.430
(16.00) .630
(11.30) .445
(12.19) .480
(7.62) .300
(33.78) 1.330
(28.70) 1.130
(8.51) .335
T–1S6–07–X–2
(2.28)
.090
DIA
(0.76)
.030
(0.64)
.025
SQ
T–1S6–08–X–2
T–1S6–09–X–2
T–1S6–10–X–2
T–1S6–11–X–2
T–1S6–12–X–2
SPECIFICATIONS
T-1S6
T Series is available with
a choice of Gold or Tin
plating. Add -G or -T as
a suffix to the part
number shown.
-G Plating:
Au over 50 µ"
(1.27 µm) Ni
-T Plating:
Sn over 50 µ" (1.27 µm)
Ni or 100 µ" (2.54 µm) Cu
RECOMMENDED
PC HOLE SIZE:
LEAD SIZE
(0.46) .018 DIA
(0.51) .020 DIA
(0.64) .025 DIA
(0.76) .030 DIA
(0.89) .035 DIA
(1.14) .045 DIA
(1.32) .052 DIA
(0.46) .018 SQ
(0.64) .025 SQ
(1.14) .045 SQ
(0.20) .008 x (0.71) .028
(0.25) .010 x (0.51) .020
(0.41) .016 x (0.51) .020
(0.41) .016 x (0.61) .024
(0.41) .016 x (0.79) .031
HOLE SIZE
(0.61) .024 DIA
(0.66) .026 DIA
(0.79) .031 DIA
(0.91) .036 DIA
(1.04) .041 DIA
(1.30) .051 DIA
(1.47) .058 DIA
(0.76) .030 DIA
(1.02) .040 DIA
(1.75) .069 DIA
(0.89) .035 DIA
(0.71) .028 DIA
(0.79) .031 DIA
(0.89) .035 DIA
(1.04) .041 DIA
(2.18)
.086
DIA
(9.53)
.375
(1.98)
.078
DIA
(0.71)
.028
B
T–1S6–13–X–2
T–1S6–14–X–2
T–1S6–15–X–2
T–1S6–16–X–2
(3.18)
.125
T–1S6–17–X–2
T–1S6–18–X–2
T–1S6–19–X–2
T–1S6–20–X–2
T–1S6–21–X–2
(0.76)
.030
DIA
Pins are supplied on a bandolier.
Material: Phosphor Bronze
X = Plating option (specify G or T)
–G = 10 µ" (0.25 µm) Gold on (4.19 mm) .165"
contact area. Gold flash on balance
–T = 200 µ" (5.08 µm) Tin
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
Insertion Depth = (4.45 mm ) .175" to (5.46 mm) .215"
Lead DIA Accepted = (0.81 mm) .032" to (0.97 mm) .038"
Plating Available = GG, GT
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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