PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan, R.O.C.
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: para@para.com.tw
DATA SHEET
PART NO. : A-1001Y G/W
REV :
A/0
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-11-07-0180
DCC : ____________
Page : 1
HD-R/RD012
DATE : 2007-10-30
1.00
INCH
SINGLE
DIGIT DISPLAY
REV:A / 0
A-1001Y G/W
PACKAGE DIMENSIONS
NOTES : 1. All dimensions are in millimeters. (inches)
2. Tolerance is
±
0.25(0.010") unless otherwise specified.
DRAWING NO. : DS-11-07-0180
DATE : 2007-10-30
Page : 2
HD-R/RD013
1.00
INCH
SINGLE
DIGIT DISPLAY
REV:A / 0
A-1001Y G/W
FEATURES
25.20mm (1.00 inch ) DIGIT HEIGHT
COMMON ANODE
I.C. COMPATIBLE
LOW POWER CONSUMPTION
Pb FREE PRODUCTS
GRAY FACE, WHITE SEGMENTS
Raw Material : GaAsP/GaP
ABSOLUTE MAXIMUM RATING : ( Ta = 25°C )
SYMBOL
P
D
V
R
I
AF
I
PF
－
Topr
Tstg
PARAMETER
Power Dissipation Per Segment
Reverse Voltage Per Segment(DP)
Continuous Forward Current Per Segment
Peak Forward Current Per Segment
(1/10 Duty Cycle,0.1ms Pulse Width)
Derating
Linear From 25°C Per Segment
Operating Temperature Range
Storage Temperature Range
YELLOW
120
10(5)
20
80
0.27
UNIT
mW
V
mA
mA
mA/°C
－35°C
to 85°C
－35°C
to 85°C
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C )
SYMBOL
V
F
I
R
λ
P
λ
D
∆
λ
I
V
PARAMETER
Forward Voltage , Per Segment(DP)
Reverse Current , Per Segment(DP)
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half－Width
Luminous Intensity Per Segment
TEST
CONDITION
I
F
= 20mA
V
R
= 10(5)V
I
F
= 20mA
I
F
= 20mA
I
F
= 20mA
I
F
= 10mA
1.2
583
585
30
3.0
MIN.
TYP.
MAX. UNIT
V
µA
nm
nm
nm
mcd
4.2(2.1) 5.6(2.8)
100
DRAWING NO. : DS-11-07-0180
DATE : 2007-10-30
Page : 3
HD-R/RD014
1.00
INCH
SINGLE
DIGIT DISPLAY
REV:A / 0
A-1001Y G/W
DRAWING NO. : DS-11-07-0180
DATE : 2007-10-30
Page : 4
1.00
SOLDERING
METHOD
INCH
SINGLE
DIGIT DISPLAY
REV:A / 0
A-1001Y G/W
SOLDERING CONDITIONS
REMARK
DIP
SOLDERING
Bath temperature: 260 max
Immersion time: within 5 sec
Solder no closer than 2mm from
the base of the package
Using soldering flux,” RESIN FLUX”
is recommended.
During soldering, take care not to
Soldering iron: 30W or smaller
press the tip of iron against the
SOLDERING
Temperature at tip of iron: 260
℃
or lower PIN.
IRON
Soldering time: within 5 sec.
(To prevent heat from being
transferred directly to the PIN.)
1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be
careful not to stress the PIN with iron tip. When soldering Display in a condition that the package is
fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid
damaging the Display.
Fig.1
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and silver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly
3 seconds.
DRAWING NO. : DS-11-07-0180
DATE : 2007-10-30
Page : 5
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