1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance
λd
: ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
ABSOLUTE MAXIMUM RATINGS at T
A
=25°C
Parameter
Power Dissipation
Reverse Voltage
Junction Temperature
Operating Temperature
Storage Temperature
DC Forward Current
Peak Forward Current
t
h
ig
r
b
g
in
K
Value
Symbol
Hyper Red
75
5
P
D
V
R
T
j
T
op
T
stg
I
F
I
FM [1]
30
185
3000
450
250
115
-40 to +85
-40 to +85
Super Bright Green
62.5
5
110
Unit
mW
V
°C
°C
°C
25
140
8000
500
300
260°C For 3 Seconds
260°C For 5 Seconds
mA
mA
V
°C/W
°C/W
Electrostatic Discharge Threshold (HBM)
Thermal Resistance (Junction / Ambient)
Thermal Resistance (Junction / Solder point)
Lead Solder Temperature
[3]
Lead Solder Temperature
[4]
-
R
th JA [2]
R
th JS [2]
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. R
t h JA
,R
t h JS
Results from mounting on PC board FR4 (pad size
≥
16 mm
2
per pad).
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature
≤
30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.
LED Mounting Method
1. The lead pitch of the LED must match the
pitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
K
g
in
ig
r
b
t
h
"
○
"
Correct mounting method "
x
" Incorrect mounting method
Lead Forming Procedures
1. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering.
2. The tip of the soldering iron should never touch the lens epoxy.
3. Through-hole LEDs are incompatible with reflow soldering.
4. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at
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