IC,BUS TRANSCEIVER,SINGLE,8-BIT,CMOS,LDCC,28PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown |
| 控制类型 | COMMON CONTROL |
| 计数方向 | BIDIRECTIONAL |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 最大I（ol） | 0.002 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 70 ns |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| MM82PC08V/A+ | MM82PC08JI/A+ | MM82PC08JM/A+ | MM82PC08J/883 | MM82PC08NI/A+ | MM82PC08VI/A+ | |
|---|---|---|---|---|---|---|
| 描述 | IC,BUS TRANSCEIVER,SINGLE,8-BIT,CMOS,LDCC,28PIN,PLASTIC | IC,BUS TRANSCEIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,CERAMIC | IC,BUS TRANSCEIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,CERAMIC | IC,BUS TRANSCEIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,CERAMIC | IC,BUS TRANSCEIVER,SINGLE,8-BIT,CMOS,DIP,20PIN,PLASTIC | IC,BUS TRANSCEIVER,SINGLE,8-BIT,CMOS,LDCC,28PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, LDCC28,.5SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown |
| 控制类型 | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 代码 | S-PQCC-J28 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 | S-PQCC-J28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 最大I（ol） | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 20 | 20 | 20 | 20 | 28 |
| 最高工作温度 | 70 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP | DIP | DIP | QCCJ |
| 封装等效代码 | LDCC28,.5SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | LDCC28,.5SQ |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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