Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> UPD78CP14CW

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UPD78CP14CW: 产品描述8-BIT, OTPROM, 15MHz, MICROCONTROLLER, PDIP64, SHRINK, PLASTIC, DIP-64; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共74页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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UPD78CP14CW概述

8-BIT, OTPROM, 15MHz, MICROCONTROLLER, PDIP64, SHRINK, PLASTIC, DIP-64

UPD78CP14CW规格参数

参数名称	属性值
是否Rohs认证	不符合
零件包装代码	DIP
包装说明	0.750 INCH, SHRINK, PLASTIC, DIP-64
针数	64
Reach Compliance Code	unknown
具有ADC	YES
地址总线宽度	8
位大小	8
CPU系列	UPD7800
最大时钟频率	15 MHz
DAC 通道	NO
DMA 通道	NO
外部数据总线宽度	8
JESD-30 代码	R-PDIP-T64
JESD-609代码	e0
长度	57.655 mm
I/O 线路数量	40
端子数量	64
最高工作温度	85 °C
最低工作温度	-40 °C
PWM 通道	NO
封装主体材料	PLASTIC/EPOXY
封装代码	SDIP
封装等效代码	SDIP64,.75
封装形状	RECTANGULAR
封装形式	IN-LINE, SHRINK PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
认证状态	Not Qualified
RAM（字节）	256
ROM（单词）	16384
ROM可编程性	OTPROM
座面最大高度	5.08 mm
速度	15 MHz
最大压摆率	32 mA
标称供电电压	5 V
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	1.778 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	19.05 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER
Base Number Matches	1

文档解析

μPD78CP14GF-3BE 采用 64 引脚塑料扁平封装（14×20 mm），是一款紧凑型 8 位微控制器，集成一次性 PROM。产品专为便携和嵌入式系统设计，封装厚度薄，适用于空间敏感应用。内部 PROM 容量 16KB，支持软件配置为不同内存模式（如 μPD78C14 的 16KB 模式）。单电源供电 5V ±10%，兼容工业标准电压。关键特性包括多功能 I/O 端口（如 PD 端口用于地址/数据总线，PF 端口用于高位地址输出），支持串行通信（TxD、RxD、SCK）和定时器功能（TI、TO）。内存扩展通过 MODE 引脚和 MM 寄存器实现，可控制内部 RAM 访问和 PROM 范围。编程过程兼容 μPD27C256A，提供写入、验证和读取模式。未使用引脚推荐连接至 VDD 或 VSS 以优化 EMC 性能。适用于音频/视频设备、个人电子产品和工业机器人。质量等级为标准级，开发工具链支持高效编程和验证。封装设计便于散热和焊接，符合 RoHS 环保要求。

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UPD78CP14CW相似产品对比

	UPD78CP14CW	UPD78CP14KB	UPD78CP14L	UPD78CP14G-36
描述	8-BIT, OTPROM, 15MHz, MICROCONTROLLER, PDIP64, SHRINK, PLASTIC, DIP-64	8-BIT, OTPROM, 15MHz, MICROCONTROLLER, CQCC64, CERAMIC, WQFN-64	8-BIT, OTPROM, 15MHz, MICROCONTROLLER, PQCC68, PLASTIC, QFJ-68	8-BIT, OTPROM, 15MHz, MICROCONTROLLER, PQIP64, PLASTIC, QUIP-64
零件包装代码	DIP	QFN	QFJ	DIP
包装说明	0.750 INCH, SHRINK, PLASTIC, DIP-64	QCCN,	PLASTIC, QFJ-68	PLASTIC, QUIP-64
针数	64	64	68	64
Reach Compliance Code	unknown	unknown	compliant	unknown
具有ADC	YES	YES	YES	YES
地址总线宽度	8	8	8	8
位大小	8	8	8	8
最大时钟频率	15 MHz	15 MHz	15 MHz	15 MHz
DAC 通道	NO	NO	NO	NO
DMA 通道	NO	NO	NO	NO
外部数据总线宽度	8	8	8	8
JESD-30 代码	R-PDIP-T64	R-CQCC-N64	S-PQCC-J68	R-PDIP-T64
长度	57.655 mm	24.2 mm	24.2 mm	41.5 mm
I/O 线路数量	40	40	40	40
端子数量	64	64	68	64
PWM 通道	NO	NO	NO	NO
封装主体材料	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SDIP	QCCN	QCCJ	DIP
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	IN-LINE, SHRINK PITCH	CHIP CARRIER	CHIP CARRIER	IN-LINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM可编程性	OTPROM	OTPROM	OTPROM	OTPROM
座面最大高度	5.08 mm	4.6 mm	4.6 mm	3.7 mm
速度	15 MHz	15 MHz	15 MHz	15 MHz
表面贴装	NO	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS
端子形式	THROUGH-HOLE	NO LEAD	J BEND	THROUGH-HOLE
端子节距	1.778 mm	1.27 mm	1.27 mm	2.54 mm
端子位置	DUAL	QUAD	QUAD	DUAL
宽度	19.05 mm	24.2 mm	24.2 mm	24.13 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
是否Rohs认证	不符合	-	不符合	不符合
CPU系列	UPD7800	-	UPD7800	UPD7800
JESD-609代码	e0	-	e0	e0
最高工作温度	85 °C	-	85 °C	85 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C
封装等效代码	SDIP64,.75	-	LDCC68,1.0SQ	QUIP64A,.7/.9
峰值回流温度（摄氏度）	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
电源	5 V	-	5 V	5 V
RAM（字节）	256	-	256	256
ROM（单词）	16384	-	16384	16384
最大压摆率	32 mA	-	32 mA	32 mA
标称供电电压	5 V	-	5 V	5 V
温度等级	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1	1	-

UPD78CP14CW

UPD78CP14CW概述

UPD78CP14CW规格参数

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