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UPD4481362GF-A50-A

产品描述IC,SYNC SRAM,256KX36,CMOS,QFP,100PIN,PLASTIC
产品类别存储    存储   
文件大小221KB,共28页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
标准
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UPD4481362GF-A50-A概述

IC,SYNC SRAM,256KX36,CMOS,QFP,100PIN,PLASTIC

UPD4481362GF-A50-A规格参数

参数名称属性值
是否Rohs认证符合
Reach Compliance Codeunknown
Base Number Matches1

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DATA SHEET
MOS INTEGRATED CIRCUIT
μ
PD4481162, 4481182, 4481322, 4481362
8M-BIT ZEROSB
TM
SRAM
PIPELINED OPERATION
Description
The
μ
PD4481162 is a 524,288-word by 16-bit, the
μ
PD4481182 is a 524,288-word by 18-bit, the
μ
PD4481322 is a
262,144-word by 32-bit and the
μ
PD4481362 is a 262,144-word by 36-bit ZEROSB static RAM fabricated with
advanced CMOS technology using full CMOS six-transistor memory cell.
The
μ
PD4481162,
μ
PD4481182,
μ
PD4481322 and
μ
PD4481362 are optimized to eliminate dead cycles for read to
write, or write to read transitions. These ZEROSB static RAMs integrate unique synchronous peripheral circuitry, 2-bit
burst counter and output buffer as well as SRAM core. All input registers are controlled by a positive edge of the
single clock input (CLK).
The
μ
PD4481162,
μ
PD4481182,
μ
PD4481322 and
μ
PD4481362 are suitable for applications which require
synchronous operation, high speed, low voltage, high density and wide bit configuration, such as buffer memory.
ZZ has to be set LOW at the normal operation. When ZZ is set HIGH, the SRAM enters Power Down State (“Sleep”).
In the “Sleep” state, the SRAM internal state is preserved. When ZZ is set LOW again, the SRAM resumes normal
operation.
The
μ
PD4481162,
μ
PD4481182,
μ
PD4481322 and
μ
PD4481362 are packaged in 100-pin PLASTIC LQFP with a 1.4
mm package thickness for high density and low capacitive loading.
Features
Low voltage core supply : V
DD
= 3.3 ± 0.165 V (-A44, -A50, -A60, -A75, -A44Y, -A50Y, -A60Y, -A75Y)
V
DD
= 2.5 ± 0.125 V (-C60, -C75, -C60Y, -C75Y)
Synchronous operation
Operating temperature : T
A
= 0 to 70
°C
(-A44, -A50, -A60, -A75, -C60, -C75)
T
A
=
−40
to
+85 °C
(-A44Y, -A50Y, -A60Y, -A75Y, -C60Y, -C75Y)
100 percent bus utilization
Internally self-timed write control
Burst read / write : Interleaved burst and linear burst sequence
Fully registered inputs and outputs for pipelined operation
All registers triggered off positive clock edge
3.3V or 2.5V LVTTL Compatible : All inputs and outputs
Fast clock access time : 2.8 ns (225 MHz), 3.2 ns (200 MHz), 3.5 ns (167 MHz) , 4.2 ns (133 MHz)
Asynchronous output enable : /G
Burst sequence selectable : MODE
Sleep mode : ZZ (ZZ = Open or Low : Normal operation)
Separate byte write enable : /BW1 to /BW4 (
μ
PD4481322 and
μ
PD4481362)
/BW1 and /BW2 (
μ
PD4481162 and
μ
PD4481182)
Three chip enables for easy depth expansion
Common I/O using three state outputs
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. M15562EJ4V0DS00 (4th edition)
Date Published February 2006 NS CP(K)
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.

 
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