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5962-9205701MXA

产品描述FIFO, 1KX18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68
产品类别存储    存储   
文件大小617KB,共21页
制造商IDT (Integrated Device Technology)
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5962-9205701MXA概述

FIFO, 1KX18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68

5962-9205701MXA规格参数

参数名称属性值
零件包装代码PGA
包装说明PGA,
针数68
Reach Compliance Codeunknown
ECCN代码EAR99
周期时间50 ns
JESD-30 代码S-CPGA-P68
JESD-609代码e0
长度29.464 mm
内存密度18432 bit
内存宽度18
功能数量1
端子数量68
字数1024 words
字数代码1000
工作模式SYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织1KX18
输出特性3-STATE
可输出YES
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码PGA
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度5.207 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式PIN/PEG
端子节距2.54 mm
端子位置PERPENDICULAR
宽度29.464 mm
Base Number Matches1

5962-9205701MXA相似产品对比

5962-9205701MXA 5962-9318902MXA 5962-9205702MXA 5962-9210102MXA 5962-9205703MXA 5962-9210103MXA 5962-9210101MXA 5962-9318903MXA 5962-9318901MXA
描述 FIFO, 1KX18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 FIFO, 4KX18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 FIFO, 1KX18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 FIFO, 512X18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 FIFO, 1KX18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 FIFO, 512X18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 FIFO, 512X18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 FIFO, 4KX18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 FIFO, 4KX18, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68
零件包装代码 PGA PGA PGA PGA PGA PGA PGA PGA PGA
包装说明 PGA, PGA, PGA, PGA, PGA, PGA, PGA, CAVITY-UP, PGA-68 PGA,
针数 68 68 68 68 68 68 68 68 68
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
周期时间 50 ns 35 ns 35 ns 35 ns 25 ns 25 ns 50 ns 25 ns 50 ns
JESD-30 代码 S-CPGA-P68 S-CPGA-P68 S-CPGA-P68 S-CPGA-P68 S-CPGA-P68 S-CPGA-P68 S-CPGA-P68 S-CPGA-P68 S-CPGA-P68
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm
内存密度 18432 bit 73728 bit 18432 bit 9216 bit 18432 bit 9216 bit 9216 bit 73728 bit 73728 bit
内存宽度 18 18 18 18 18 18 18 18 18
功能数量 1 1 1 1 1 1 1 1 1
端子数量 68 68 68 68 68 68 68 68 68
字数 1024 words 4096 words 1024 words 512 words 1024 words 512 words 512 words 4096 words 4096 words
字数代码 1000 4000 1000 512 1000 512 512 4000 4000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 1KX18 4KX18 1KX18 512X18 1KX18 512X18 512X18 4KX18 4KX18
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
可输出 YES YES YES YES YES YES YES YES YES
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 PGA PGA PGA PGA PGA PGA PGA PGA PGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
座面最大高度 5.207 mm 5.207 mm 5.207 mm 5.207 mm 5.207 mm 5.207 mm 5.207 mm 5.207 mm 5.207 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
端子形式 PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR
宽度 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm 29.464 mm
Base Number Matches 1 1 1 1 1 1 1 1 -
厂商名称 - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)

 
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