IC Socket, BGA160, 160 Contact(s),
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
联系完成配合 | GOLD (20) OVER NICKEL |
联系完成终止 | Gold (Au) - with Nickel (Ni) barrier |
触点材料 | BERYLLIUM COPPER ALLOY |
设备插槽类型 | IC SOCKET |
使用的设备类型 | BGA160 |
外壳材料 | LIQUID CRYSTAL POLYMER |
JESD-609代码 | e4 |
触点数 | 160 |
Base Number Matches | 1 |
YFE-20-01-G-08-LC | YFE-20-01-G-10-LC | YFE-30-01-G-10-A | YFE-30-01-G-10-K | YFE-30-01-G-10-LC | YFE-30-01-G-10-TR | YFE-40-01-G-10-K | YFE-40-01-G-10-TR | YFE-50-01-G-10-A | YFE-50-01-G-10-TR | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | IC Socket, BGA160, 160 Contact(s), | IC Socket, BGA200, 200 Contact(s), | IC Socket, BGA300, 300 Contact(s), | IC Socket, BGA300, 300 Contact(s), | IC Socket, BGA300, 300 Contact(s), | IC Socket, BGA300, 300 Contact(s), | IC Socket, BGA400, 400 Contact(s), | IC Socket, BGA400, 400 Contact(s), | IC Socket, BGA500, 500 Contact(s), | IC Socket, BGA500, 500 Contact(s), |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
联系完成配合 | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL | GOLD (20) OVER NICKEL |
联系完成终止 | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier |
触点材料 | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY | BERYLLIUM COPPER ALLOY |
设备插槽类型 | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET |
使用的设备类型 | BGA160 | BGA200 | BGA300 | BGA300 | BGA300 | BGA300 | BGA400 | BGA400 | BGA500 | BGA500 |
外壳材料 | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER | LIQUID CRYSTAL POLYMER |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
触点数 | 160 | 200 | 300 | 300 | 300 | 300 | 400 | 400 | 500 | 500 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved