80960HA/HD/HT 32-Bit High-Performance
Superscalar Processor
Datasheet
Product Features
s
s
s
s
s
s
32-Bit Parallel Architecture
— Load/Store Architecture
— Sixteen 32-Bit Global Registers
— Sixteen 32-Bit Local Registers
— 1.28 Gbyte Internal Bandwidth
(80 MHz)
— On-Chip Register Cache
Processor Core Clock
— 80960HA is 1x Bus Clock
— 80960HD is 2x Bus Clock
— 80960HT is 3x Bus Clock
Binary Compatible with Other 80960
Processors
Issue Up To 150 Million Instructions per
Second
High-Performance On-Chip Storage
— 16 Kbyte Four-Way Set-Associative
Instruction Cache
— 8 Kbyte Four-Way Set-Associative Data
Cache
— 2 Kbyte General Purpose RAM
Separate 128-Bit Internal Paths For
Instructions/Data
s
s
s
s
s
3.3 V Supply Voltage
— 5 V Tolerant Inputs
— TTL Compatible Outputs
Guarded Memory Unit
— Provides Memory Protection
— User/Supervisor Read/Write/Execute
32-Bit Demultiplexed Burst Bus
— Per-Byte Parity Generation/Checking
— Address Pipelining Option
— Fully Programmable Wait State Generator
— Supports 8-, 16- or 32-Bit Bus Widths
— 160 Mbyte/s External Bandwidth
(40 MHz)
High-Speed Interrupt Controller
— Up to 240 External Interrupts
— 31 Fully Programmable Priorities
— Separate, Non-maskable Interrupt Pin
Dual On-Chip 32-Bit Timers
— Auto Reload Capability and One-Shot
— CLKIN Prescaling, divided by 1, 2, 4 or 8
— JTAG Support - IEEE 1149.1 Compliant
Order Number: 272495-009
August 2004
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 80960HA/HD/HT 32-Bit High-Performance Superscalar Processor may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel’s website at http://www.intel.com.
Copyright © Intel Corporation, 2002,
2004
AlertVIEW, AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, CT Connect, CT Media, Dialogic, DM3, EtherExpress,
ETOX, FlashFile, i386, i486, i960, iCOMP, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Create & Share,
Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel Play, Intel Play logo, Intel
SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation, Intel Xeon, Intel XScale, IPLink, Itanium, LANDesk, LanRover, MCS, MMX, MMX
logo, Optimizer logo, OverDrive, Paragon, PC Dads, PC Parents, PDCharm, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your
Command, RemoteExpress, Shiva, SmartDie, Solutions960, Sound Mark, StorageExpress, The Computer Inside., The Journey Inside,
TokenExpress, Trillium, VoiceBrick, Vtune, and Xircom are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United
States and other countries.
*Other names and brands may be claimed as the property of others.
2
Datasheet
Contents
Contents
1.0
2.0
About This Document
................................................................................................................... 9
Intel 80960Hx Processor
............................................................................................................... 9
2.1
2.2
The i960
®
Processor Family ...............................................................................................10
Key 80960Hx Features .......................................................................................................10
2.2.1 Execution Architecture ...........................................................................................10
2.2.2 Pipelined, Burst Bus ..............................................................................................10
2.2.3 On-Chip Caches and Data RAM............................................................................11
2.2.4 Priority Interrupt Controller.....................................................................................11
2.2.5 Guarded Memory Unit ...........................................................................................11
2.2.6 Dual Programmable Timers ...................................................................................12
2.2.7 Processor Self Test ...............................................................................................12
Instruction Set Summary ....................................................................................................13
Pin Descriptions ..................................................................................................................15
80960Hx Mechanical Data..................................................................................................20
3.2.1 80960Hx PGA Pinout.............................................................................................20
3.2.2 80960Hx PQ4 Pinout .............................................................................................26
Package Thermal Specifications ........................................................................................31
Heat Sink Adhesives...........................................................................................................34
PowerQuad4 Plastic Package ............................................................................................34
Stepping Register Information ............................................................................................34
Sources for Accessories .....................................................................................................36
Absolute Maximum Ratings ................................................................................................37
Operating Conditions ..........................................................................................................37
Recommended Connections ..............................................................................................38
VCC5 Pin Requirements (V
DIFF
) ........................................................................................38
VCCPLL Pin Requirements ................................................................................................39
DC Specifications ...............................................................................................................40
AC Specifications................................................................................................................42
4.7.1 AC Test Conditions ................................................................................................45
AC Timing Waveforms ........................................................................................................46
80960Hx Boundary Scan Chain .........................................................................................84
Boundary Scan Description Language Example ................................................................88
2.3
3.0
3.1
3.2
Package Information
...................................................................................................................14
3.3
3.4
3.5
3.6
3.7
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
5.0
5.1
5.2
Electrical Specifications
.............................................................................................................37
Bus Waveforms
...........................................................................................................................54
Figures
1
2
3
4
5
6
80960Hx Block Diagram ............................................................................................................... 9
80960Hx 168-Pin PGA Pinout—View from Top (Pins Facing Down) .........................................20
80960Hx 168-Pin PGA Pinout—View from Bottom (Pins Facing Up) ........................................21
80960Hx 208-Pin PQ4 Pinout.....................................................................................................26
Measuring 80960Hx PGA Case Temperature ............................................................................31
80960Hx Device Identification Register......................................................................................34
Datasheet
3
Contents
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
VCC5 Current-Limiting Resistor ................................................................................................. 38
AC Test Load.............................................................................................................................. 45
CLKIN Waveform........................................................................................................................ 46
Output Delay Waveform ............................................................................................................. 46
Output Delay Waveform ............................................................................................................. 46
Output Float Waveform .............................................................................................................. 47
Input Setup and Hold Waveform ................................................................................................ 47
NMI, XINT7:0 Input Setup and Hold Waveform.......................................................................... 47
Hold Acknowledge Timings ........................................................................................................ 48
Bus Backoff (BOFF) Timings ...................................................................................................... 48
TCK Waveform ........................................................................................................................... 49
Input Setup and Hold Waveforms for T
BSIS1
and TBSIH1.......................................................... 49
Output Delay and Output Float for TBSOV1 and TBSOF1 ........................................................ 50
Output Delay and Output Float Waveform for TBSOV2 and TBSOF2 ....................................... 50
Input Setup and Hold Waveform for TBSIS2 and TBSIH2 ......................................................... 50
Rise and Fall Time Derating at 85 °C and Minimum VCC.......................................................... 51
I
CC
Active (Power Supply) vs. Frequency................................................................................... 51
I
CC
Active (Thermal) vs. Frequency............................................................................................ 52
Output Delay or Hold vs. Load Capacitance .............................................................................. 52
Output Delay vs. Temperature ................................................................................................... 53
Output Hold Times vs. Temperature .......................................................................................... 53
Output Delay vs. VCC ................................................................................................................ 53
Cold Reset Waveform ................................................................................................................ 54
Warm Reset Waveform .............................................................................................................. 55
Entering ONCE Mode................................................................................................................. 56
Non-Burst, Non-Pipelined Requests without Wait States ........................................................... 57
Non-Burst, Non-Pipelined Read Request with Wait States ........................................................ 58
Non-Burst, Non-Pipelined Write Request with Wait States ........................................................ 59
Burst, Non-Pipelined Read Request without Wait States, 32-Bit Bus ........................................ 60
Burst, Non-Pipelined Read Request with Wait States, 32-Bit Bus ............................................. 61
Burst, Non-Pipelined Write Request without Wait States, 32-Bit Bus ........................................ 62
Burst, Non-Pipelined Write Request with Wait States, 32-Bit Bus ............................................. 63
Burst, Non-Pipelined Read Request with Wait States, 16-Bit Bus ............................................. 64
Burst, Non-Pipelined Read Request with Wait States, 8-Bit Bus ............................................... 65
Non-Burst, Pipelined Read Request without Wait States, 32-Bit Bus ........................................ 66
Non-Burst, Pipelined Read Request with Wait States, 32-Bit Bus ............................................. 67
Burst, Pipelined Read Request without Wait States, 32-Bit Bus ................................................ 68
Burst, Pipelined Read Request with Wait States, 32-Bit Bus ..................................................... 69
Burst, Pipelined Read Request with Wait States, 8-Bit Bus ....................................................... 70
Burst, Pipelined Read Request with Wait States, 16-Bit Bus ..................................................... 71
Using External READY............................................................................................................... 72
Terminating a Burst with BTERM ............................................................................................... 73
BREQ and BSTALL Operation ................................................................................................... 74
BOFF Functional Timing. BOFF occurs during a burst or non-burst data cycle. ........................ 75
HOLD Functional Timing ............................................................................................................ 76
LOCK Delays HOLDA Timing..................................................................................................... 77
FAIL Functional Timing............................................................................................................... 77
A Summary of Aligned and Unaligned Transfers for 32-Bit Regions.......................................... 78
A Summary of Aligned and Unaligned Transfers for 32-Bit Regions (Continued) ...................... 79
A Summary of Aligned and Unaligned Transfers for 16-Bit Bus................................................. 80
4
Datasheet
Contents
57 A Summary of Aligned and Unaligned Transfers for 8-Bit Bus...................................................81
58 Idle Bus Operation ......................................................................................................................82
59 Bus States ..................................................................................................................................83
Tables
1
2
3
4
5
6
7
8
9
10
11
13
12
15
14
17
18
16
19
20
21
22
23
25
24
26
80960Hx Product Description ....................................................................................................... 9
Fail Codes For BIST (bit 7 = 1) ...................................................................................................12
Remaining Fail Codes (bit 7 = 0) ................................................................................................12
80960Hx Instruction Set .............................................................................................................13
80960HA/HD/HT Package Types and Speeds...........................................................................14
Pin Description Nomenclature ....................................................................................................15
80960Hx Processor Family Pin Descriptions..............................................................................16
80960Hx 168-Pin PGA Pinout—Signal Name Order..................................................................22
80960Hx 168-Pin PGA Pinout—Pin Number Order ...................................................................24
80960Hx PQ4 Pinout—Signal Name Order................................................................................27
80960Hx PQ4 Pinout—Pin Number Order .................................................................................29
80960Hx 168-Pin PGA Package Thermal Characteristics .........................................................32
Maximum T
A
at Various Airflows in °C (PGA Package Only) .....................................................32
80960Hx 208-Pin PQ4 Package Thermal Characteristics..........................................................33
Maximum T
A
at Various Airflows in °C (PQ4 Package Only)......................................................33
80960Hx Device ID Model Types ...............................................................................................35
Device ID Version Numbers for Different Steppings...................................................................35
Fields of 80960Hx Device ID ......................................................................................................35
Absolute Maximum Ratings ........................................................................................................37
Operating Conditions ..................................................................................................................37
V
DIFF
Specification for Dual Power Supply Requirements (3.3 V, 5 V) ......................................39
80960Hx DC Characteristics ......................................................................................................40
80960Hx AC Characteristics.......................................................................................................42
80960Hx Boundary Scan Test Signal Timings ...........................................................................44
AC Characteristics Notes............................................................................................................44
80960Hx Boundary Scan Chain .................................................................................................84
Datasheet
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
