FEATURES
APPLICATIONS
High dvdt
–
Good Pulse Current
–
Stable with Temperature
and Frequency
Inverters/Converters
–
Power Semiconductor Circuits
–
Induction Heating
–
Switching Power Supplies
-40°C to +85°C
+10% at 1 kHz, 25°C
+5% optional
1000
1200
1500
1550
1750
2200
1000
1200
1500
525
550
600
C>1uF
0.07%
30000 MΩxμF
(not to exceed 30GΩ)
<1 nano-Henry per mm of lead spacing
<0.5% after 2 years at 40°C
30000 hours @VAC, 70°C
100000 hours @VDC, 70°C
Capacitance Change
<3% of initially measured value
300/ billion component hours
56 days at 40°C with 90 to 95%RH, +40°C and no voltage applied
Capacitance Change
<2% of initially measured value
Dissipation Factor
<0.0001 at 1kHz and 25°C
Insulation Resistance
>50% of maximum specified value
<1 nano-Henry per mm of body length and lead length
<1.0% after 2 years at 40°C
-200 ppm/°C, +100ppm/°C
Terminal to Terminal
Terminal to case
160% of rated VDC or 200% VDC
3kVAC, 50/60Hz applied between the
applied for 2 Seconds and 25°C
leads and case for 60 seconds
Polypropylene
Metallized film with internal series connections
Flame Retardant polyester tape wrap (UL 501) with epoxy resin end fill(UL94V0)
Lead free tinned copper leads
Operating Temperature Range
Capacitance Tolerance
Surge Voltage(SVDC)
AC voltage (50/60 Hz)
Dissipation Factor (MAX)
25°C
Insulation Resistance
@25°C (<70% RH)for 1 minute at
100VDC applied
Self Inductance
Capacitance Drift Factor
Life Expectancy
Failure Quota
Damp Heat test
Self Inductance
Capacitance Drift Factor
Capacitance Temperature
Coefficient
Dielectric Strength
Dielectric
Construction
Coating
Leads
WVDC
700
850
SVDC
1100
1300
WVDC
700
850
VAC
420
500
Frequency
C<0.1uF
(kHz)
1
0.05%
2000
2600
2000
650
2500
3300
2500
700
3000
4000
3000
750
L MAX
D
d +0.05
29
<17.5
0.8
34
<18
0.8
34
>18
1.0
46
<25
1.0
46
>25
1.2
55
all
1.2
59
all
1.2
Feb-17
NXP MCU
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