Power Supply Management Circuit Adjustable 1 Channel CMOS PDSO8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Xicor Inc |
包装说明 | PLASTIC, SOIC-8 |
Reach Compliance Code | unknown |
可调阈值 | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 4.9 mm |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 3.9 mm |
Base Number Matches | 1 |
X4325S8 | X4323S8 | X4323V8 | X4323V8I | X4325V8 | X4323S8I | |
---|---|---|---|---|---|---|
描述 | Power Supply Management Circuit Adjustable 1 Channel CMOS PDSO8 | Power Supply Management Circuit Adjustable 1 Channel CMOS PDSO8 | Power Supply Management Circuit, Adjustable, 1 Channel, CMOS, PDSO8, PLASTIC, TSSOP-8 | Power Supply Management Circuit, Adjustable, 1 Channel, CMOS, PDSO8, PLASTIC, TSSOP-8 | Power Supply Management Circuit, Adjustable, 1 Channel, CMOS, PDSO8, PLASTIC, TSSOP-8 | Power Supply Management Circuit, Adjustable, 1 Channel, CMOS, PDSO8, PLASTIC, SOIC-8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc |
包装说明 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, TSSOP-8 | PLASTIC, TSSOP-8 | PLASTIC, TSSOP-8 | PLASTIC, SOIC-8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
可调阈值 | YES | YES | YES | YES | YES | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 4.9 mm | 4.9 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.9 mm |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | TSSOP | TSSOP | TSSOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 3 mm | 3.9 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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