INTRODUCTION
Molex's latest Micro PGA sockets are designed to
accept Mobile Pentium* 4 and Mobile Celeron*
Processor-M series for applications such as thin
notebooks and blade servers. These high-density
sockets feature low profiles and proven Ball Grid
Array (BGA) soldering technology for stable PCB
processing.
The new sockets include an easy-to-use cam
mechanism and stainless steel cam retainer to
prevent wear-and-tear on the housing during use.
The terminal includes a dual-beam chamfered
contact for good electrical performance, and BGA-
interface design to ensure good thermal mismatch
control between components and the PCB.
Molex's Micro PGA sockets are part of our growing
family of innovative socketing solutions for
processor, memory and test applications.
FEATURES AND BENEFITS
Applications:
■
Notebook PCs
■
Blade Servers
Micro PGA Socket
478/479 Circuits
For Mobile Pentium* 4
ZIF Type, BGA Mount
Blade Server
*Pentium and Celeron are registered trademarks of Intel
Corporation
Stainless steel cam retainer protects
plastic cover from wear.
Blue Color Version For
Centrino* Mobile
Technology Processors
Dual-beam chamfered
contact design provides
low insertion force and
good electrical
performance.
LCP housing and cover
with profile height of
3.30mm (.130")
Accepts energy-saving Pentium mobile processors
■
For notebooks, blade servers and small desktop PCs
■
478 circuits
■
Small pin layout difference and blue color to
differentiate from standard P4-M socket
■
Same features as standard P4-M socket
■
Order No.: 500210-4784
■
Ball Grid Array (BGA) solder balls are
self-centering and avoid the problem of
bent tails.
SPECIFICATIONS
Housing
Contact
Solder Ball
Physical
CAM
CAM Holder
Plating—Contact Area
Underplating
Operating Temperature
Black LCP, UL 94V-0
Copper Alloy
Tin/Lead, 0.76mm (.030") dia.
Stainless Steel
Stainless Steel
Gold
Nickel
-20 to +90˚C
Reference
Mechanical
Electrical
* Centrino is a trademark of Intel Corporation
Voltage
Current
Contact Resistance
Dielectric Withstanding Voltage
Insulation Resistance
Durability
Product Specification
Packaging
Designed In
100V
0.5A
25 milliohms max.
AC 360V
800 Megohms min.
50 cycles
PS-51248-005
Hard Tray/ Embossed Tape
Millimeters
MICRO PGA DRAWING
Micro PGA Socket
478/479 Circuits
For Mobile Pentium* 4
ZIF Type, BGA Mount
ORDERING INFORMATION
Circuits
478
479
Order No.
Hard Tray
51248-4782
51248-4792
Embossed Tape
51248-4784
51248-4794
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
Tel: 1-800-78MOLEX
amerinfo@molex.com
Far East North Headquarters
Yamato, Kanagawa, Japan
Tel: 81-462-65-2324
feninfo@molex.com
Far East South Headquarters
Jurong, Singapore
Tel: 65-6268-6868
fesinfo@molex.com
European Headquarters
Munich, Germany
Tel: 49-89-413092-0
eurinfo@molex.com
Corporate Headquarters
2222 Wellington Court
Lisle, Illinois 60532 U.S.A.
Tel: 630-969-4550
amerinfo@molex.com
Visit our Web site at http: // www.molex.com
Order No. JPN-034
Printed in Japan/3K/MXJ/Brain House/2003.03
©2003, Molex Japan
模拟电子
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
