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74552-0001

产品描述1.85mm by 1.85mm (.073” by .073”) GbX* Cable Assembly
文件大小301KB,共2页
制造商Molex
官网地址https://www.molex.com/molex/home
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74552-0001概述

1.85mm by 1.85mm (.073” by .073”) GbX* Cable Assembly

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FEATURES AND SPECIFICATIONS
1.85mm by 1.85mm
(.073” by .073”)
GbX* Cable Assembly
74552
4-Pair Configuration
GbX, the next-generation high-speed backplane interconnect cabling system, delivers over 6 Gbps
and signal density of 55 differential pairs per linear inch
The GbX high-performance backplane cable assemblies
and connectors provide the speed and density required
by leading-edge backplane designs. With a native
differential signaling speed of 6.0 Gbps, the system
is well suited for existing and future generations of
XAUI (10 Gigabit Attachment Unit Interface) and
InfiniBand
- based systems.
GbX cable assemblies offer improved capabilities to
current backplane cable products, with impedance
matching, low pair-to-pair crosstalk, within-pair and
pair-to-pair skew control and a variety of raw-cable
designs to meet customer-specific loss budgets. Cables
are available in a 4-pair (column) configuration.
GbX High Performance Cable Assemblies complement
Molex’s existing line of GbX products. For more
information on Molex’s extensive GbX product offering,
please visit: www.molex.com/ads/GbX.html.
Features and Benefits
Design
4-pair configuration provides 55 real-differential
pairs per linear inch (2, 3 and 5 pair configurations
are possible extensions)
allowing high density
with more differential pairs than similar backplane
products
Bifurcated contact beams assure greater reliability
with two points of contact to header pins
Ground shield for individual pairs reduces crosstalk
at the mating interface for improved system
performance
SPECIFICATIONS
Reference Information
Mates With:
GbX right-angle male connector (Series 75717)
GbX standard 4-pair header (Series 75235)
Designed In: Millimeters
Electrical
Current: 1.0A
Dielectric Withstanding Voltage: 250V
Insulation Resistance: 40 Megohms min.
Mechanical
Contact Insertion Force:
44.48N (10.00 lbf) typical per contact
Contact Retention to Housing:
8.90N (2.00 lbf) min. per contact
Insertion Force to PCB:
0.59N (0.13 lbf) max. per contact
Mating Force: 0.59N (0.13 lbf) max. per contact
Unmating Force: 0.29N (0.07 lbf) min. per contact
Durability: 250 cycles max.
Physical
Housing: LCP, UL 94V-0
Contact: Copper (Cu) Alloy
Plating:
Contact Area — 0.76 um (30u”) Gold (Au) min.
Solder Tail Area — Tin (Sn)
Underplating — Nickel (Ni)
PCB Thickness: 1.60mm (.062”) typical
Operating Temperature: -55 to +105°C
GbX Cable Assembly (left), Daughter Card Connector (right), Backplane Header (front)
Process
Opposed gap-resistance welding re-flows cable
conductor into the signal contact, providing a clean
electrical path
Zinc or Aluminum die-cast backshells provide
shielding protection for custom Input/Output
backplane designs
Integrated stiffeners and latches provide mechanical
robustness and solid mating to vertical or right-
angle mating (RAM) headers
Low-pressure, strain-relief insert molding provides
strain relief for the termination area and allows
tighter cable shield to conductor tolerances for
better impedance control
GbX 4-Pair Wafer – Signal View
*GbX is a registered trademark of Amphenol, Corp.
†InfiniBand is a registered trademark of the InfiniBand Trade Association
‡Contact Molex for tooling justification

 
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