FEATURES AND SPECIFICATIONS
Features and Benefits
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Up to 5.0 Gbps bandwidth per signal pair enables
state-of-the-art system design and performance
2.00 by 2.25mm (.079 by .089”) pitch provides real
signal density of 10 differential pairs for 5-row and
6-row and 15 differential pairs for 8-row per
centimeter (25 and 38 pairs respectively per inch)
Minimum distance between daughtercards:
– 5-row system offers 15.00mm (.591")
– 6-row system offers 18.00mm (.709")
– 8-row system offers 22.00mm (.866")
Ground planes between signal columns provide
tightly controlled impedance for rise times down to
50 picoseconds (10-90%). This ensures very low
cross talk between signals within and between
columns
Ground pins are in the same grid as signal pins,
allowing wider channels for PCB routing and traces
up to 0.25mm (.010”) wide
6-row or 8-row VHDM-HSD wafers can be applied to
the same stiffener as standard VHDM
®
6-row or 8-
row wafers. The combination of VHDM and VHDM-
HSD wafers, grouped together in the same stiffener,
provides cost effective solutions to different
performance parameters
2.00 by 2.25mm
(.079 by .089") Pitch
5-Row, 6-Row and 8-Row
VHDM-HSD
™
Module-to-Backplane
Connector System
The daughtercard connector consists of a metal stiffener
just as with the VHDM system. The system combines the
signal wafers, power modules and guidance modules
into one continuous connector that can be ordered as a
single specific part number. The card pitch of the VHDM-
HSD 8-row system is the same as the standard VHDM 8-
row system, allowing both signal wafer types for single
ended and differential pair to be used together. This
The same great modularity features and components of
modularity and design flexibility allow engineers to
VHDM are provided in the VHDM-HSD. The 5-row and 6-
incorporate both connector systems on the same
row systems feature 2 signal pairs per column and the
platforms. The system is based on a 2.00mm (.079")
8-row system features 3 signal pairs per column in
pitch and includes vertical and right angle products that
increments of 10 and 25 columns. All circuits are
can be configured up to 2000 circuits. The maximum
utilized as signal circuits without the need to use some as
length of a daughtercard connector on a single stiffener
ground circuits.
is 300mm (12").
The Very High Density Metric High Speed Differential
(VHDM-HSD) connector system has been expanded to
include 5-row, 6-row and 8-row daughtercard and
backplane modules. VHDM-HSD is designed for
differential-pair architecture applications that require
very high interconnect density and signal integrity in a
single-ended configuration.
The backplane connectors feature headers with open
ends for continuous side-to-side stacking and headers
with guide pins and polarizing keys on either end to aid
in proper alignment of the mating daughtercard. The
power modules occupy just a small width and hold
sequentially matable pins that each manage 10.0 amps
of current.
Molex offers application tooling for pressing VHDM-HSD
connectors into PCBs as separate modules or as complete
assemblies. VHDM-HSD cable assemblies are also
available for connecting backplane headers to high-
performance cables.
Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.
FEATURES AND SPECIFICATIONS
Applications
The VHDM-HSD products are used in very high speed,
short rise-time, high circuit count applications connecting
daughtercards to the backplane:
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Network Switches
Routers
Computer Servers
Telecommunication Equipment
Internetworking Devices
8 row Version
2.00 by 2.25mm
(.079 by .089") Pitch
5-Row, 6-Row and 8-Row
VHDM-HSD
™
Module-to-Backplane
Connector System
Modular Construction
Internal Ground Planes
10 amp Power Blades
Press Fit Right Angle Receptacle
ORDERING INFORMATION
Daughtercard Assembly
Signal wafers, power modules and guide modules sequentially
assigned by application
Backplane Header
Pin Height
Signal Module Standard Loaded 0.76µm (30µ”) Gold
4.25mm (.167”)
4.75mm (.187”)
Open Ended
5.15mm (.203”)
6.25mm (.266”)
4.25mm (.167”)
4.75mm (.187”)
Left Guide Pin
No Polarizing Key
5.15mm (.203”)
6.25mm (.266”)
4.25mm (.167”)
4.75mm (.187”)
Left Guide Pin
“A” Polarizing Key
5.15mm (.203”)
6.25mm (.266”)
4.25mm (.167”)
4.75mm (.187”)
Right Guide Pin
No Polarizing Key
5.15mm (.203”)
6.25mm (.266”)
4.25mm (.167”)
4.75mm (.187”)
Right Guide Pin
“A” Polarizing Key
5.15mm (.203”)
6.25mm (.266”)
Backplane Power and Guide Components
Power Module
Keying Post
Guide Pin
Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.
Configuration
VHDM-HSD wafers
Combination of VHDM and VHDM-HSD wafers
5-Row
10-Column
74695-1003
74695-1001
74695-1004
74695-1002
74696-1003
74696-1001
74696-1004
74696-1002
74696-1013
74696-1011
74696-1014
74696-1012
74697-1003
74697-1001
74697-1004
74697-1002
74697-1013
74697-1011
74697-1014
74697-1012
25-Column
74695-2503
74695-2501
74695-2504
74695-2502
74696-2503
74696-2501
74696-2504
74696-2502
74696-2513
74696-2511
74696-2514
74696-2512
74697-2503
74697-2501
74697-2504
74697-2502
74697-2513
74697-2511
74697-2514
74697-2512
5-Row and 6-Row
74029-6000
74069-0010
74076-0001/0002
10-Column
74979-1003
74979-1001
74979-1004
74979-1002
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
5-Row
74670-XXXX
74686-XXXX
6-Row
25-Column
74979-2503
74979-2501
74979-2504
74979-2502
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
6-Row
74880-XXXX
74886-XXXX
8-Row
10-Column
74649-1003
74649-1001
74649-1004
74649-1002
74650-1003
74650-1001
74650-1004
74650-1002
74650-1013
74650-1011
74650-1014
74650-1012
74651-1003
74651-1001
74651-1004
74651-1002
74651-1013
74651-1011
74651-1014
74651-1012
8-Row
74029-8000
74069-0010
74076-0001/0002
8-Row
74680-XXXX
74686-XXXX
25-Column
74649-2503
74649-2501
74649-2504
74649-2502
74650-2503
74650-2501
74650-2504
74650-2502
74650-2513
74650-2511
74650-2514
74650-2512
74651-2503
74651-2501
74651-2504
74651-2502
74651-2513
74651-2511
74651-2514
74651-2512
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
1-800-78MOLEX
amerinfo@molex.com
Far East North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
feninfo@molex.com
Far East South Headquarters
Jurong, Singapore
65-6-268-6868
fesinfo@molex.com
European Headquarters
Munich, Germany
49-89-413092-0
eurinfo@molex.com
Corporate Headquarters
2222 Wellington Ct.
Lisle, IL 60532 U.S.A.
630-969-4550
Visit our Web site at htt p:// www.mo lex .co m/product/b ackp lan /h sd .h tml
Order No. USA-158 Rev. 2
Printed in USA/2.5K/JI/JI/2003.03
©
2003, Molex
微控制器 MCU
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