ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20
ACT系列, 8位 驱动, 实输出, PDSO20
| 参数名称 | 属性值 |
| Brand Name | Fairchild Semiconductor |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP20,.4 |
| 针数 | 20 |
| 制造商包装代码 | 20LD, SOIC, JEDEC MS013, .300\", WIDE BODY |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Samacsys Description | Fairchild Semiconductor 74ACT541SC, Octal, Buffer, Driver 3-State, Non-Inverting, 4.5 → 5.5 V, 20-Pin SOIC |
| 其他特性 | WITH DUAL OUTPUT ENABLE |
| 控制类型 | ENABLE LOW |
| 系列 | ACT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e3 |
| 长度 | 12.8 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 7.5 ns |
| 传播延迟(tpd) | 7.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |

| 74ACT541SC | 74AC541 | 74AC541_08 | 74ACT541 | 74ACT541MTC | 74AC541SJ | 74AC541MTC | |
|---|---|---|---|---|---|---|---|
| 描述 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | Octal Buffer/Line Driver with 3-STATE Outputs | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 |
| 系列 | ACT | 交流 | 交流 | 交流 | ACT | AC | AC |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 输出特性 | 3-STATE | 3-ST | 3-ST | 3-ST | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 表面贴装 | YES | Yes | Yes | Yes | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | 双 | 双 | 双 | DUAL | DUAL | DUAL |
| Brand Name | Fairchild Semiconductor | - | - | - | Fairchild Semiconduc | Fairchild Semiconduc | Fairchild Semiconduc |
| 是否无铅 | 不含铅 | - | - | - | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | - | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | - | - | - | TSSOP | SOP | TSSOP |
| 包装说明 | SOP, SOP20,.4 | - | - | - | TSSOP, TSSOP20,.25 | SOP, SOP20,.3 | TSSOP, TSSOP20,.25 |
| 针数 | 20 | - | - | - | 20 | 20 | 20 |
| 制造商包装代码 | 20LD, SOIC, JEDEC MS013, .300\", WIDE BODY | - | - | - | 20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE | 20LD,SOP,EIAJ TYPE II, 5.3MM WIDE | 20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE |
| Reach Compliance Code | compliant | - | - | - | compli | compli | compli |
| ECCN代码 | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 |
| 其他特性 | WITH DUAL OUTPUT ENABLE | - | - | - | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
| 控制类型 | ENABLE LOW | - | - | - | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 代码 | R-PDSO-G20 | - | - | - | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e3 | - | - | - | e4 | e3 | e4 |
| 长度 | 12.8 mm | - | - | - | 6.5 mm | 12.6 mm | 6.5 mm |
| 负载电容(CL) | 50 pF | - | - | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | - | - | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I(ol) | 0.024 A | - | - | - | 0.024 A | 0.012 A | 0.012 A |
| 湿度敏感等级 | 1 | - | - | - | 1 | 1 | 1 |
| 端口数量 | 2 | - | - | - | 2 | 2 | 2 |
| 最高工作温度 | 85 °C | - | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | - | - | - | TSSOP | SOP | TSSOP |
| 封装等效代码 | SOP20,.4 | - | - | - | TSSOP20,.25 | SOP20,.3 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | - | - | NOT SPECIFIED | 260 | 260 |
| 电源 | 5 V | - | - | - | 5 V | 3.3/5 V | 3.3/5 V |
| 传播延迟(tpd) | 7.5 ns | - | - | - | 7.5 ns | 9 ns | 9 ns |
| 认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | - | - | - | 1.2 mm | 2.1 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | - | - | 5.5 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | - | - | - | 4.5 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | - | - | - | 5 V | 3.3 V | 3.3 V |
| 技术 | CMOS | - | - | - | CMOS | CMOS | CMOS |
| 端子面层 | Matte Tin (Sn) | - | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子节距 | 1.27 mm | - | - | - | 0.65 mm | 1.27 mm | 0.65 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | - | NOT SPECIFIED | 30 | NOT SPECIFIED |
| 宽度 | 7.5 mm | - | - | - | 4.4 mm | 5.3 mm | 4.4 mm |
| Base Number Matches | 1 | - | - | - | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved