Universal Bus Functions 18B Univ Bus Driver
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP |
包装说明 | GREEN, PLASTIC, TSSOP-56 |
针数 | 56 |
Reach Compliance Code | unknown |
控制类型 | ENABLE LOW |
系列 | ALVC/VCX/A |
JESD-30 代码 | R-PDSO-G56 |
JESD-609代码 | e4 |
长度 | 14 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.024 A |
湿度敏感等级 | 1 |
位数 | 18 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 56 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP56,.3,20 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
Prop。Delay @ Nom-Sup | 4.5 ns |
传播延迟(tpd) | 5.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 1.65 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6.1 mm |
Base Number Matches | 1 |
74ALVCH16835DGGRG4 | SN74ALVCH16835DL | 74ALVCH16835ZQLR | 74ALVCH16835DGVRG4 | 74ALVCH16835DGVRE4 | 74ALVCH16835DGGRE4 | SN74ALVCH16835KR | |
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描述 | Universal Bus Functions 18B Univ Bus Driver | Bus Transceivers 18bit Univ Bus | Universal Bus Functions 18B Universal Bus Dr | Universal Bus Functions 18B Universal Bus Dr | Universal Bus Functions Auto Cat Config Mult-Function Gate | Universal Bus Functions 18B Universal Bus Dr | Universal Bus Functions 18bit Univ Bus |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP | SSOP | BGA | SSOP | SSOP | TSSOP | BGA |
包装说明 | GREEN, PLASTIC, TSSOP-56 | SSOP, SSOP56,.4 | GREEN, PLASTIC, VFBGA-56 | GREEN, PLASTIC, TVSOP-56 | GREEN, PLASTIC, TVSOP-56 | GREEN, PLASTIC, TSSOP-56 | VFBGA, BGA56,6X10,25 |
针数 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | _compli |
控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
系列 | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A |
JESD-30 代码 | R-PDSO-G56 | R-PDSO-G56 | R-PBGA-B56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PBGA-B56 |
长度 | 14 mm | 18.415 mm | 7 mm | 11.3 mm | 11.3 mm | 14 mm | 7 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
位数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | SSOP | VFBGA | TSSOP | TSSOP | TSSOP | VFBGA |
封装等效代码 | TSSOP56,.3,20 | SSOP56,.4 | BGA56,6X10,25 | TSSOP56,.25,16 | TSSOP56,.25,16 | TSSOP56,.3,20 | BGA56,6X10,25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
包装方法 | TAPE AND REEL | TUBE | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
传播延迟(tpd) | 5.5 ns | 5.5 ns | 5.5 ns | 5.5 ns | 5.5 ns | 5.5 ns | 5.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 2.79 mm | 1 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | BALL | GULL WING | GULL WING | GULL WING | BALL |
端子节距 | 0.5 mm | 0.635 mm | 0.65 mm | 0.4 mm | 0.4 mm | 0.5 mm | 0.65 mm |
端子位置 | DUAL | DUAL | BOTTOM | DUAL | DUAL | DUAL | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 6.1 mm | 7.49 mm | 4.5 mm | 4.4 mm | 4.4 mm | 6.1 mm | 4.5 mm |
是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | - |
JESD-609代码 | e4 | - | - | e4 | e4 | e4 | - |
湿度敏感等级 | 1 | - | - | 1 | 1 | 1 | - |
Prop。Delay @ Nom-Sup | 4.5 ns | - | 4.5 ns | 4.5 ns | 4.5 ns | 4.5 ns | - |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | - |
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