Johnson decade counter with 10 decoded outputs
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC16,.1X.14,20 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| 其他特性 | JOHNSON COUNTER WITH 10 DECODED OUTPUTS |
| 计数方向 | UP |
| 系列 | HCT |
| JESD-30 代码 | R-XQCC-N16 |
| JESD-609代码 | e4 |
| 长度 | 3.5 mm |
| 负载电容(CL) | 50 pF |
| 负载/预设输入 | NO |
| 逻辑集成电路类型 | RING COUNTER |
| 最大频率@ Nom-Su | 20000000 Hz |
| 最大I(ol) | 0.004 A |
| 工作模式 | SYNCHRONOUS |
| 湿度敏感等级 | 1 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.1X.14,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 5 V |
| 传播延迟(tpd) | 75 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 2.5 mm |
| 最小 fmax | 20 MHz |
| Base Number Matches | 1 |

| 74HCT4017BQ | 74HC4017D | 74HCT4017 | 74HC4017N | 74HC4017 | 74HCT4017N | 74HC4017PW | 74HC4017BQ | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Johnson decade counter with 10 decoded outputs | Johnson decade counter with 10 decoded outputs | Johnson decade counter with 10 decoded outputs | Johnson decade counter with 10 decoded outputs | Johnson decade counter with 10 decoded outputs | Johnson decade counter with 10 decoded outputs | Johnson decade counter with 10 decoded outputs | Johnson decade counter with 10 decoded outputs |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | QFN | SOIC | - | DIP | - | DIP | TSSOP | QFN |
| 包装说明 | HVQCCN, LCC16,.1X.14,20 | SOP, SOP16,.25 | - | DIP, DIP16,.3 | - | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 | HVQCCN, LCC16,.1X.14,20 |
| 针数 | 16 | 16 | - | 16 | - | 16 | 16 | 16 |
| Reach Compliance Code | compli | unknow | - | unknow | - | unknow | unknow | compli |
| 其他特性 | JOHNSON COUNTER WITH 10 DECODED OUTPUTS | JOHNSON COUNTER WITH 10 DECODED OUTPUTS | - | JOHNSON COUNTER WITH 10 DECODED OUTPUTS | - | JOHNSON COUNTER WITH 10 DECODED OUTPUTS | JOHNSON COUNTER WITH 10 DECODED OUTPUTS | JOHNSON COUNTER WITH 10 DECODED OUTPUTS |
| 计数方向 | UP | UP | - | UP | - | UP | UP | UP |
| 系列 | HCT | HC/UH | - | HC/UH | - | HCT | HC/UH | HC/UH |
| JESD-30 代码 | R-XQCC-N16 | R-PDSO-G16 | - | R-PDIP-T16 | - | R-PDIP-T16 | R-PDSO-G16 | R-XQCC-N16 |
| 长度 | 3.5 mm | 9.9 mm | - | 19.025 mm | - | 19.025 mm | 5 mm | 3.5 mm |
| 负载电容(CL) | 50 pF | 50 pF | - | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 负载/预设输入 | NO | NO | - | NO | - | NO | NO | NO |
| 逻辑集成电路类型 | RING COUNTER | RING COUNTER | - | RING COUNTER | - | RING COUNTER | RING COUNTER | RING COUNTER |
| 最大频率@ Nom-Su | 20000000 Hz | 20000000 Hz | - | 20000000 Hz | - | 20000000 Hz | 20000000 Hz | 20000000 Hz |
| 最大I(ol) | 0.004 A | 0.004 A | - | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 位数 | 10 | 10 | - | 10 | - | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | - | 1 | - | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | - | 16 | - | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | HVQCCN | SOP | - | DIP | - | DIP | TSSOP | HVQCCN |
| 封装等效代码 | LCC16,.1X.14,20 | SOP16,.25 | - | DIP16,.3 | - | DIP16,.3 | TSSOP16,.25 | LCC16,.1X.14,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | - | IN-LINE | - | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | - | NOT SPECIFIED | - | NOT SPECIFIED | 260 | 260 |
| 电源 | 5 V | 2/6 V | - | 2/6 V | - | 5 V | 2/6 V | 2/6 V |
| 传播延迟(tpd) | 75 ns | 375 ns | - | 75 ns | - | 75 ns | 75 ns | 75 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.75 mm | - | 4.2 mm | - | 4.2 mm | 1.1 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | - | 6 V | - | 5.5 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | - | 2 V | - | 4.5 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | NO | - | NO | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | - | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD | GULL WING | - | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 1.27 mm | - | 2.54 mm | - | 2.54 mm | 0.65 mm | 0.5 mm |
| 端子位置 | QUAD | DUAL | - | DUAL | - | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | NOT SPECIFIED | - | NOT SPECIFIED | 30 | 30 |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 2.5 mm | 3.9 mm | - | 7.62 mm | - | 7.62 mm | 4.4 mm | 2.5 mm |
| 最小 fmax | 20 MHz | 24 MHz | - | 20 MHz | - | 20 MHz | 20 MHz | 20 MHz |
| Base Number Matches | 1 | 1 | - | 1 | - | 1 | 1 | 1 |
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