Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-PDIP -40 to 85
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | TSSOP, TSSOP20,.25 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | R-PDSO-G20 |
| 逻辑集成电路类型 | D LATCH |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 4.3 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74LVT573PW | 74LVT573 | 74LVT573D | 74LVT573DB | 74LVT573PWDH | |
|---|---|---|---|---|---|
| 描述 | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-PDIP -40 to 85 | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-PDIP -40 to 85 | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-PDIP -40 to 85 | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-PDIP -40 to 85 | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-PDIP -40 to 85 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | - |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
| 包装说明 | TSSOP, TSSOP20,.25 | - | SOP, SOP20,.4 | SSOP, SSOP20,.3 | - |
| Reach Compliance Code | unknow | - | unknow | unknow | - |
| JESD-30 代码 | R-PDSO-G20 | - | R-PDSO-G20 | R-PDSO-G20 | - |
| 逻辑集成电路类型 | D LATCH | - | D LATCH | D LATCH | - |
| 最大I（ol） | 0.032 A | - | 0.032 A | 0.032 A | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | - |
| 位数 | 8 | - | 8 | 8 | - |
| 功能数量 | 1 | - | 1 | 1 | - |
| 端子数量 | 20 | - | 20 | 20 | - |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSSOP | - | SOP | SSOP | - |
| 封装等效代码 | TSSOP20,.25 | - | SOP20,.4 | SSOP20,.3 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | - |
| 电源 | 3.3 V | - | 3.3 V | 3.3 V | - |
| Prop。Delay @ Nom-Su | 4.3 ns | - | 4.3 ns | 4.3 ns | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | - |
| 表面贴装 | YES | - | YES | YES | - |
| 技术 | BICMOS | - | BICMOS | BICMOS | - |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | - |
| 端子节距 | 0.635 mm | - | 1.27 mm | 0.635 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | - |
| Base Number Matches | 1 | - | 1 | 1 | - |
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