comprised of multiple strands of high tensile wire
that intermesh to create an electrical connection.
HDB
3
Mother Board
Connector
HDB
3
Daughter Board
Connector
BENEFITS OF THE BRUSH CONTACT
• Redundant current paths: 14-70 gas tight points
of contact per mated bunch
• Very smooth low friction interface
• Low mating forces: 1.5 oz. typical per contact,
70-90% lower than conventional contacts
• Long contact life: 100,000 cycles of mating and
unmating without performance degradation
• Documented intermittency free performance: No
10 nano-second discontinuities during
50,000,000 cycles of 0.010” displacement
• Impervious to fretting
• Contact interface meets M55302/166 thru /171
HDB
3
CONNECTOR PERFORMANCE
Durability:
Insertion/Extraction Force:
Operating Temperature:
Current Rating:
100,000 mating cycles
1.5 ounce typical per contact
-65° to 150°C
2 amperes
Hot swap 1 ampere maximum
(load dependent)
5 gigaohms minimum
750 volts, 60 hertz, rms @ Sea
Level 250 volts, 60 hertz,
rms @ 70,000 feet Elevation
MIL-STD-202, Method 208
48 Hours IAW MIL-STD-1344,
method 1001, test condition B
IAW MIL-STD-1344, method
1002, type II
4 hours in each of 3 mutually
perpendicular axes IAW MIL-ST
1344, method 2005,
test condition V, letter H
1 shock along each of three
mutually perpendicular axes IAW
MIL-STD-1344, method 2004,
test condition G
Capable of 3.125 Gbps (consult
Amphenol for arrangement)
Printed in U.S.A.
1/8/2009
Insulation Resistance:
Dielectric Withstanding
Voltage:
Solderability:
Salt Fog:
HDB
3
FEATURES
Polarization:
Keying:
Guide Pins
Radial Misalignment:
“D” shaped design
Optional keys offer 36 unique
keying combinations
Optional guide pins provide
additional alignment
Capable of correcting up to a
.020" initial radial misalign-
ment
Capable of mating with up to a
2° initial angular misalignment
Humidity:
Vibration:
Shock:
Angular Misalignment:
Data Rate:
@2009 Amphenol Corporation
Amphenol
1
HDB
3
MATERIALS
Insulator:
Contact:
Liquid crystal polymer, 30% glass filled
Wire:
Beryllium copper per ASTM B197; finish is gold per ASTM B488
over nickel per AMS-QQ-N-290.
Holder:
Brass similar to UNS C33500; finish is gold per MIL-G-45204 or tin-lead per
MIL-P-81728 or tin per MIL-T-10727 (RoHS Compliant).
Sleeve:
Stainless Steel per AMS-5514, passivated IAW QQ-P-35
(Daughter Board connector only)
Stainless Steel
Keys/Guide Pins:
MOTHER BOARD
.335 MAX.
.150 ±.005
.350
.086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
DAUGHTER BOARD
.350
.325
.086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
3
4
6
1
2
5
5
2
.150 ±.020
TYP.
PIN 1
1
6
PIN 1
3
4
.035
TYP.
A
B
C
.070
TYP.
B
A
B
E
.016 ±.001
TYP.
C
D
.016 ±.001
DIA. TYP.
F
A
E
B
A
F
C
D
.090 TYP.
.030 TYP.
.195 MIN. HEX
.070 MIN DEEP
(USE 3/16 HEX HEAD)
.150 ±.020
TYP.
.060 TYP.
.540
.420
.025
040
080
120
160
Number of
Contacts
40
80
120
160
Dimension
A
1.375
2.075
1.775
3.475
Dimension Dimension
B
C
0.800
1.075
1.500
1.775
2.200
2.475
2.900
3.175
.350
.410
.470
.530
All dimensions for reference only.
CUSTOM CONFIGURATIONS
• Hybrid configurations are available with any combination
of brush and power, coax, and/or fiber optic contacts
• Partially populated arrangements for high voltage or high
speed data transfer up to 3.125 Gbps. (shown at right)
Consult Amphenol Aerospace with your design requirements.
2
HDB
3
MOTHER BOARD CONNECTOR HOW TO ORDER
Example part number:
HDB-M4
3
HDB-M4 - 040
M
20 2 X
Hardware
Type
X
G
H
J
T
U
V
No Hardware
Polarization Key
Qty. 2
Polarization Key
Qty. 2
Polarization Key
Qty. 2
Guide Pin
Qty. 2
Guide Pin
Qty. 2
Guide Pin
Qty. 2
Stickout
(Dim. K)
N/A
0.250
0.500
0.750
0.250
0.500
0.750
Designates HDB Mother Board Connectors
Number of
Contacts
40
80
120
160
Dimension
A
1.375
2.075
1.775
3.475
Dimension Dimension
B
C
0.800
1.075
1.500
1.775
2.200
2.475
2.900
3.175
Number of Contacts
040
080
120
160
Brush Wire Plating
M
C
0.000050 Au Min. thick over Nickel
0.000020 Au Min. thick over Nickel
Termination
Type
20
21
22
23
24
25
PCB, Straight, .016 Dia.
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
Stickout
(Dim. E)
0.060
0.090
0.120
0.150
0.180
0.210
Type
26
27
28
29
30
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
Stickout
(Dim. E)
0.240
0.270
0.300
0.360
0.420
Contact Terminition Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .00030 Min.
thick Gold over .000050 Min. thick
Nickel
Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
5
6
HDB-M4-XXXXXXXX drawing is available on-line at
www.amphenol-aerospace.com. Then go to board level, then go to HDB3.
HDB
3
DAUGHTER BOARD CONNECTOR HOW TO ORDER
Example part number:
HDB-D4
HDB-D4 - 040
M
02 2 X
Hardware
X
P
L
Type
No Hardware
Polarization Key
Qty. 2
Polarization Key
Qty. 2
Designates HDB
3
Daughter Board Connectors
Number of
Contacts
40
80
120
160
Dimension
A
1.375
2.075
1.775
3.475
Dimension Dimension
B
C
0.800
1.075
1.500
1.775
2.200
2.475
2.900
3.175
Number of Contacts
040
080
120
160
Brush Wire Plating
M
C
0.000050 Au Min. thick over Nickel
0.000020 Au Min. thick over Nickel
Contact Terminition Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .00030 Min.
thick Gold over .000050 Min. thick
Nickel
Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
Termination
Type
00
01
02
03
04
05
06
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
Stickout
(Dim. E)
0.060
0.090
0.120
0.150
0.180
0.210
0.300
5
6
HDB-D4-XXXXXXXX drawing is available on-line at
www.amphenol-aerospace.com. Then go to board level, then go to HDB3.
3
Recommended Mother Board Layout
B
.110 ±.005
Recommended Daughter Board Layout
B
.060
.110 ±.005
.205
.005
M
.005
M
.025
.030
.070
.060
.035
FINISHED HOLE SIZE PER
CUSTOMER STANDARDS FOR
.016 PCB TAIL
A
BOARD
EDGE
.035
FINISHED HOLE SIZE PER
CUSTOMER STANDARDS FOR
A
.016 PCB TAIL
.070
.
300
.150
.205
Dimensions
No. of Contacts
40
80
120
160
B
1.075
1.775
2.475
3.175
MOTHER
BOARD
MOTHER
BOARD
CONNECTOR
Mated Connector Pair Assembled
to Boards (0.680” Total Mated Height)
DAUGHTER
BOARD
CONNECTOR
.500
.560
.620
.680
DAUGHTER
BOARD
Mother Board Connector Keying (Optional)
Daughter Board Connector Keying (Optional)
4
CONNECTOR COMPARISON
The Amphenol HDB
3
Connector offers advantages over competitive connectors:
• Higher density contact pattern
• Uses less board space
• Allows for shorter mated height
• Provides the durability and performance of the Brush contact
• Low cost
Amphenol
HDB
3
Contact System
Durability, Mating Cycles
Contact Mating Forces, Ounces
Mother Board
Brush
100,000
1.5
.070 X .060
.070 X .060
.350
680
29
38
37
37
43
40
46
40
Contacts
40
80
86
102
120
110
160
164
Hypertronics
HPH
Hyperboloid
2,000
1.5
.075 X .075
.075 X .100
.443
.986
Airborn
RM4
Pin & Socket
500
2.5
.075 X .070
.075 X .100
.400
.915
Contact Arrangement
Connector Width
Daughter Board
Mated Height, MB to 4th row of DB .
Contacts per Linear
Inch (Contacts/
Connector Length)
For additional information on this product or other Amphenol products contact:
Amphenol Corporation
Amphenol Aerospace
40-60 Delaware Avenue
Sidney, New York 13838-1395
Phone: 800-678-0141 and ask for BLP (Board Level Product) Marketing
Email: blp-marketing @amphenol-aerospace.com
Web: www.amphenol-aerospace.com
See Amphenol Low Mating Force Rectangular Connectors Catalog, 12-035.
Notice:
Specifications are subject to change without notice. Contact your nearest Amphenol Corporation Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate
and reliable but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty
that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should assume that all safety measures are indicated or that other measures may not be required. Specifications
are typical and may not apply to all connectors.
AMPHENOL is a registered trademark of Amphenol Corporation.
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
ADI 工业技术
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
