Multiplexer, 1-Func, 8 Line Input, TTL, PDSO16,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | SOP, SOP16,.25 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | MULTIPLEXER |
最大I(ol) | 0.024 A |
功能数量 | 1 |
输入次数 | 8 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | TAPE AND REEL |
电源 | 5 V |
最大电源电流(ICC) | 24 mA |
Prop。Delay @ Nom-Sup | 11 ns |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
N74F251D-T | 54F251/B2C | N74F251AD-T | N74F251AN-B | 54F251/BEA | N74F251ADB | |
---|---|---|---|---|---|---|
描述 | Multiplexer, 1-Func, 8 Line Input, TTL, PDSO16, | Multiplexer, 1-Func, 8 Line Input, TTL, CQCC20 | Multiplexer, 1-Func, 8 Line Input, TTL, PDSO16, | Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, PDSO16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G16 | S-XQCC-N20 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
最大I(ol) | 0.024 A | 0.02 A | 0.024 A | 0.024 A | 0.02 A | 0.024 A |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
输入次数 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 16 | 20 | 16 | 16 | 16 | 16 |
最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
封装代码 | SOP | QCCN | SOP | DIP | DIP | SOP |
封装等效代码 | SOP16,.25 | LCC20,.35SQ | SOP16,.25 | DIP16,.3 | DIP16,.3 | SOP16,.25 |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
最大电源电流(ICC) | 24 mA | 26 mA | 29 mA | 29 mA | 26 mA | 29 mA |
Prop。Delay @ Nom-Sup | 11 ns | 12.5 ns | 11.5 ns | 11.5 ns | 12.5 ns | 11.5 ns |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | NO | NO | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
包装说明 | SOP, SOP16,.25 | - | SOP, SOP16,.25 | DIP, DIP16,.3 | - | SOP, SOP16,.25 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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