EE PLD, 7.5ns, 128-Cell, CMOS, PQFP100,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | QFP, TQFP100,.63SQ |
Reach Compliance Code | unknown |
其他特性 | YES |
系统内可编程 | YES |
JESD-30 代码 | S-PQFP-G100 |
JESD-609代码 | e0 |
JTAG BST | YES |
宏单元数 | 128 |
端子数量 | 100 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | TQFP100,.63SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | 3.3 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 7.5 ns |
认证状态 | Not Qualified |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
PZ3128AS7BP | PZ3128DS10BP | PZ3128AS10BE | PZ3128AS7BE | PZ3128AS12BP | PZ3128AS10BP | PZ3128DS10BE | |
---|---|---|---|---|---|---|---|
描述 | EE PLD, 7.5ns, 128-Cell, CMOS, PQFP100, | EE PLD, 10ns, 128-Cell, CMOS, PQFP100, | EE PLD, 10ns, 128-Cell, CMOS, PQFP128, | EE PLD, 7.5ns, 128-Cell, CMOS, PQFP128, | EE PLD, 12ns, 128-Cell, CMOS, PQFP100, | EE PLD, 10ns, 128-Cell, CMOS, PQFP100, | EE PLD, 10ns, 128-Cell, CMOS, PQFP128, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | YES | YES | YES | YES | YES | YES | YES |
系统内可编程 | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PQFP-G100 | S-PQFP-G100 | R-PQFP-G128 | R-PQFP-G128 | S-PQFP-G100 | S-PQFP-G100 | R-PQFP-G128 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
JTAG BST | YES | YES | YES | YES | YES | YES | YES |
宏单元数 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
端子数量 | 100 | 100 | 128 | 128 | 100 | 100 | 128 |
最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
封装等效代码 | TQFP100,.63SQ | TQFP100,.63SQ | QFP128,.63X.87,20 | QFP128,.63X.87,20 | TQFP100,.63SQ | TQFP100,.63SQ | QFP128,.63X.87,20 |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
电源 | 3.3 V | 3/3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3/3.3 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 7.5 ns | 10 ns | 10 ns | 7.5 ns | 12 ns | 10 ns | 10 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
包装说明 | QFP, TQFP100,.63SQ | QFP, TQFP100,.63SQ | - | QFP, QFP128,.63X.87,20 | QFP, TQFP100,.63SQ | QFP, TQFP100,.63SQ | - |
标称供电电压 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
厂商名称 | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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