REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
B
C
D
E
Added changes in accordance with NOR 5962-R200-96
Added 03 and 04 device, editorial changes through out.
Added operational requirement for proper power-up reset. Updated
boiler plate paragraphs. Added device 05 and 06. ksr
Added devices 07 and 08. Updated TABLE I. ksr
Change the Y package designation, from CQCC2-F28A to
CQCC2-J28 and added footnote. Updated boilerplate paragraphs.
ksr
Update drawing to current requirements. Editorial changes
throughout. ksr.
95-10-23
96-04-29
98-01-07
99-02-12
04-09-09
M. A. Frye
M. A. Frye
Raymond Monnin
Raymond Monnin
Raymond Monnin
F
09-11-30
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
F
15
F
16
F
17
F
18
REV
SHEET
PREPARED BY
Kenneth Rice
F
19
F
1
F
2
F
3
F
4
F
5
F
6
F
7
F
8
F
9
F
10
F
11
F
12
F
13
F
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Jeff Bowling
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
95-06-06
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, ONE-TIME PROGRAMMABLE
LOGIC ARRAY, (RAD-HARD),
MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
AMSC N/A
REVISION LEVEL
F
67268
1 OF
19
5962-94754
5962-E088-10
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
H
94754
01
V
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01, 05
02
03, 06
04
07
08
Generic number
22VP10
22VP10
22VP10
22VP10
22VP10
22VP10
Circuit function
22-input 10-output
AND-OR-Logic array
22-input 10-output
AND-OR-Logic array
22-input 10-output
AND-OR-Logic array
22-input 10-output
AND-OR-Logic array
22-input 10-output
AND-OR-Logic array
22-input 10-output
AND-OR-Logic array
t
PD
25 ns
25 ns
20 ns
20 ns
15.5 ns
15.5 ns
Buffer Type
CMOS
TTL
CMOS
TTL
CMOS
TTL
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
L
Y
Descriptive designator
CDFP4-F24
GDIP3-T24 or CDIP4-T24
CQCC2-J28
Terminals
24
24
28
Package style
Flat package
Dual-in-line package
Unformed lead chip carrier package 1/
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1/
Package style description indicates this package is shipped with unformed leads; optional per footnote 9 in MIL-STD-
1835 for this package.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94754
SHEET
F
2
1.3 Absolute maximum ratings. 2/ 3/
Supply voltage range ............................................................ -0.3 V dc to +7.0 V dc
Input voltage range ............................................................... -0.3 V dc to +7.0 V dc 4/
Output voltage applied .......................................................... -0.5 V dc to +7.0 V dc 4/
Output sink current ............................................................... 12 mA
Thermal resistance, junction-to-case (θ
JC
) ............................ See MIL-STD-1835
Maximum power dissipation (P
D
) 5/ ..................................... 1.6 W
Maximum junction temperature............................................. +175C
Lead temperature (soldering, 10 seconds maximum) ........... +300C
Data retention ...................................................................... 10 years (minimum)
1.4 Recommended operating conditions.
Supply voltage range (V
DD
) ................................................... 4.5 V dc to 5.5 V dc
High level input voltage (V
IH
) TTL ......................................... 2.2 V dc minimum
Low level input voltage (V
IL
) TTL ......................................... 0.8 V dc maximum
High level input voltage (V
IH
) CMOS ..................................... 0.7 x V
DD
Low level input voltage (V
IL
) CMOS ..................................... 0.3 x V
DD
Case operating temperature range (T
C
) ................................ -55C to +125C
6/
1.5 Radiation features.
6
Maximum total dose available (dose rate = 50 - 300 rads(Si)/s)................. 1 x 10 rads(Si)
Single event phenomenon (SEP) :
effective linear energy threshold (LET);
2
with no upsets .......................................> 50 MeV-cm /mg
2
with no latch-up............................ ........ > 109 MeV-cm /mg
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2/
3/
4/
5/
6/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
All voltages referenced to V
SS
.
Minimum voltage is -0.6 V dc which may undershoot to -2.0 V dc for pulses of less than 20 ns. Maximum output pin
voltage is V
CC
+0.75 V dc which may overshoot to +7.0 V dc for pulses of less than 20 ns.
Must withstand the added P
D
due to short circuit test; e.g., I
OS
.
See 3.13 herein for important operating requirements.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94754
SHEET
F
3
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192M
-
Standard Guide for the Measurement of Single Event Phenomena (SEP)
Induced by Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to:
ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959;
http://www.astm.org.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201;
http://www.jedec.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be as specified below.
Cobalt-60 Configuration for 24 Pin DIP
Note: All inputs are through 2.5 KΩ resistor
Typical current = 90 mA for two devices
Pin number
1
2
3
4
5
6
7
8
9
10
11
12
Configuration
0,1,0
1
1
1
1
1
1
1
1
1
1
GND
Cobalt-60 Configuration for 24 Pin Flatpack
Note: All inputs are through 2.5 KΩ resistor
Typical current = 167.43 mA for two devices
Pin number
1
2
3
4
5
6
7
8
9
10
11
12
Configuration
0,1,0
1
1
1
1
1
1
1
1
1
1
GND
3.2.4 Continued on next page.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94754
SHEET
F
4
13
1
13
1
14
N/C
14
N/C
15
0
15
0
16
0
16
0
17
1
17
1
18
1
18
1
19
0
19
0
20
0
20
0
21
1
21
1
22
1
22
1
23
N/C
23
N/C
24
VDD
24
VDD
1 = VDD, 0 = GND Switch on pin 1 is to be placed at ground (0) toggled to vdd (1) and then toggled back to
ground (0) after power is applied and before irradiation to reset the device.
3.2.5
Logic diagram(s). The logic diagram(s) shall be as specified on figure 3.
3.2.6 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall
be as specified on figure 2. When required in screening (see 4.2 herein) or qualification conformance inspection, groups A, B, or
C (see 4.3), the devices shall be programmed by the manufacturer prior to test. A minimum of 50 percent of the total number of
cells shall be programmed or at least 25 percent of the total number of cells to any altered item drawing.
3.2.7 Programmed devices. The requirements for supplying programmed devices shall be as specified by an attached item
drawing.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in TABLE IA and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in TABLE IIA. The
electrical tests for each subgroup are defined in TABLE IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in
a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item drawing.
3.6.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 4.4.1 and
TABLE IIA. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
3.6.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery.
3.7 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.8 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94754
SHEET
F
5
模拟与混合信号
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
