8-bit addressable latch
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SSOP, SSOP16,.3 |
Reach Compliance Code | unknow |
JESD-30 代码 | R-PDSO-G16 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D LATCH |
最大I(ol) | 0.006 A |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SSOP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
电源 | 3.3 V |
Prop。Delay @ Nom-Su | 36 ns |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
74LV259DB | 74LV259 | 74LV259D | 74LV259N | 74LV259PWDH | 74LV259PW | |
---|---|---|---|---|---|---|
描述 | 8-bit addressable latch | 8-bit addressable latch | 8-bit addressable latch | 8-bit addressable latch | 8-bit addressable latch | 8-bit addressable latch |
是否Rohs认证 | 符合 | - | 符合 | 符合 | - | 符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SSOP, SSOP16,.3 | - | SOP, SOP16,.25 | DIP, DIP16,.3 | - | TSSOP, TSSOP16,.25 |
Reach Compliance Code | unknow | - | unknow | unknow | - | unknow |
JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDIP-T16 | - | R-PDSO-G16 |
负载电容(CL) | 50 pF | - | 50 pF | 50 pF | - | 50 pF |
逻辑集成电路类型 | D LATCH | - | D LATCH | D LATCH | - | D LATCH |
最大I(ol) | 0.006 A | - | 0.006 A | 0.006 A | - | 0.006 A |
位数 | 8 | - | 8 | 8 | - | 8 |
功能数量 | 1 | - | 1 | 1 | - | 1 |
端子数量 | 16 | - | 16 | 16 | - | 16 |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | - | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | SSOP | - | SOP | DIP | - | TSSOP |
封装等效代码 | SSOP16,.3 | - | SOP16,.25 | DIP16,.3 | - | TSSOP16,.25 |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE | IN-LINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
电源 | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V |
Prop。Delay @ Nom-Su | 36 ns | - | 36 ns | 36 ns | - | 36 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V |
表面贴装 | YES | - | YES | NO | - | YES |
技术 | CMOS | - | CMOS | CMOS | - | CMOS |
温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE |
端子形式 | GULL WING | - | GULL WING | THROUGH-HOLE | - | GULL WING |
端子节距 | 0.635 mm | - | 1.27 mm | 2.54 mm | - | 0.635 mm |
端子位置 | DUAL | - | DUAL | DUAL | - | DUAL |
Base Number Matches | 1 | - | 1 | 1 | - | 1 |
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