NAND Gate, TTL, CDFP14
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DFP, FL14,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDFP-F14 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | NAND GATE |
最大I(ol) | 0.02 A |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC |
封装代码 | DFP |
封装等效代码 | FL14,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
Prop。Delay @ Nom-Sup | 10 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
S54H00W | S54H00W/883B | N74H00F | N74H00FB | S54H00F | S54H00F/883C | S54H00F/883B | |
---|---|---|---|---|---|---|---|
描述 | NAND Gate, TTL, CDFP14 | NAND Gate, TTL, CDFP14 | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDIP14 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDFP-F14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
最大I(ol) | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DFP | DFP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Prop。Delay @ Nom-Sup | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
施密特触发器 | NO | NO | NO | NO | NO | NO | NO |
表面贴装 | YES | YES | NO | NO | NO | NO | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
厂商名称 | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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